High precision acoustic senseing device and acoustic camera using microphone array

A technology of microphone array and induction device, applied in frequency/directional characteristic device, TV, color TV components and other directions, can solve problems such as high price and complex structure, improve product quality, improve production cost, and achieve lightweight The effect of mass production

Active Publication Date: 2013-04-03
SM INSTR
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Existing products use more than 30 high-priced measurement microphones and high-priced data measurement equipment. The structure is complicated and the price is high, equivalent to about 100 million won

Method used

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  • High precision acoustic senseing device and acoustic camera using microphone array
  • High precision acoustic senseing device and acoustic camera using microphone array
  • High precision acoustic senseing device and acoustic camera using microphone array

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Embodiment Construction

[0029] The high-precision acoustic sensing device and the audio camera using the MEMS microphone array will be described in detail below with reference to the accompanying drawings. Such as Figure 1a to Figure 1b As shown, the high-precision acoustic induction device using a MEMS microphone array according to the embodiment of the present invention is composed of a plurality of MEMS microphones 10 arranged on a printed circuit board 20 . There are circuits inside the printed circuit board 20, and the circuits include, for example, a power supply circuit for supplying power or an output circuit for outputting an electric signal generated from an induced acoustic signal.

[0030] The electric signal related to the output sound is sent to the data collection unit 40 through the output circuit, and the signal amplifier is passed in the middle to increase the magnitude of the electric signal. The signal amplifier may be provided separately, or integrated with the printed circuit ...

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Abstract

The invention relates to a high precision acoustic sensing device using a microphone array. A plurality of MEMS microphones (10) are arranged in a printed circuit board (20). The invention also relates to an acoustic camera using the microphone array, comprising an acoustic sensing device (30) arranged on the printed circuit board (20) by the plurality of microphones (10); a data collection part (40) for sampling analog signals related with the acoustic sound from the acoustic sensing device (30) and converting the analog signals into digital signals and sending out the digital signals to a central processor (50); the central processor (50) for calculating noise levels respectively related with each microphone (10); a display part (60) for displaying the noise levels respectively related with each microphone (10) and calculated by the central processor (50) in different colors. The high precision acoustic sensing device and the acoustic camera using the microphone array can be used for electronic equipment produced by the existing microphones, such as mobile phones.

Description

technical field [0001] The invention relates to a high-precision acoustic induction device and an audio camera, in particular to a high-precision acoustic induction device and an audio camera using a microphone array. Background technique [0002] Audio cameras are high-end measurement devices that visualize sound, and are new technology devices that are necessary in various fields such as multimedia information communicators, home appliances, automobiles, and construction. [0003] Korean authorized patent 10-051120 (applicant: Korea Academy of Science and Technology) discloses a sound length separation method of individual sound sources using acoustic holography, including the first stage, measuring the sound pressure of multiple points in the hologram, and calculating Get the hologram spectrum ranks formed by the frequency spectrum of the sound pressure value of each point and the mutual spectrum between other points; in the second stage, apply the hologram spectrum ranks...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/20H04N5/225
CPCH04R1/40H04R19/04H04R2201/003H04N23/00
Inventor 金榮基
Owner SM INSTR
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