MEMS (micro-electro-mechanical system) microphone and method for manufacturing same

Abstract

The invention provides an MEMS (micro-electro-mechanical system) microphone which comprises an MEMS chip, an ASIC (application specific integrated circuit) chip, a first circuit substrate, a second circuit substrate, a third circuit substrate and a frame substrate. The first circuit substrate and the second circuit substrate are opposite to each other, the third circuit substrate is positioned between the first circuit substrate and the second circuit substrate, the frame substrate is respectively fixed to the first circuit substrate and the third circuit substrate, the second circuit substrate is fixed to the third circuit substrate, both the MEMS chip and the ASIC chip are mounted on the first circuit substrate, the ASIC chip is electrically connected with the third circuit substrate inside an MEMS microphone body by a lead wire, and a joint of the lead wire and the third circuit substrate is positioned on a surface, which is opposite to the second circuit substrate, of the third circuit substrate. The MEMS microphone has the advantages that the sensitivity of the product can be improved, a high-frequency response portion is improved, and the total harmonic distortion is prevented.

Description

【Technical field】 [0001] The invention relates to a MEMS microphone with a large rear cavity and a manufacturing method thereof. 【Background technique】 [0002] In the existing MEMS microphone, both the ASIC chip and the MEMS chip are fixed on the bottom circuit board, and the ASIC chip is electrically connected to the bottom circuit board through leads. The volume of the front cavity formed by the MEMS microphone of this package structure is large, and the volume of the rear cavity is small. Due to the large volume of the front cavity, the high-frequency band of the product frequency response curve will be warped, which cannot meet customer requirements. Moreover, limited by the structure of the MEMS chip, the volume of the rear cavity is small, which makes it difficult to improve the sensitivity of the product, which in turn leads to the inability to effectively improve the signal-to-noise ratio of the product. 【Content of invention】 [0003] The technical problem main...

AI Technical Summary

Problems solved by technology

[0003] The technical problem mainly solved by the present invention is that the volume of the front cavity of the existing MEMS microphone is relatively large and the volume of the rear cavity is small

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