Lighting module
A technology for light-emitting modules and light-emitting elements, which is applied to light sources, semiconductor devices of light-emitting elements, electric light sources, etc., can solve problems such as the decline of light output efficiency of LED chips, and achieve the effect of high brightness
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no. 1 Embodiment approach ）
[0049] 〔Light-emitting module〕
[0050] image 3 It is a sectional view showing the main part of the light emitting module of the first embodiment. The light emitting module 40 includes an LED chip 42 as a semiconductor light emitting element, a plate-shaped phosphor layer 44 , and a filter layer 46 . The plate-like phosphor layer 44 is provided to face the light-emitting surface 42 a of the LED chip 42 , and converts the wavelength of light emitted by the LED chip 42 . The filter layer 46 is formed on the surface 44 a of the plate-like phosphor layer 44 that faces the LED chip 42 , transmits the light emitted from the LED chip 42 and reflects the wavelength-converted light emitted by the phosphor layer 44 . Light. It should be noted that, in the light emitting module 40 of this embodiment, an air layer 48 is formed in the gap between the LED chip 42 and the filter layer 46 .
[0051] Examples of the LED chip 42 include flip-chip LEDs, vertical LEDs, and the like that are ...
no. 2 Embodiment approach ）
[0076] Image 6 It is a sectional view showing the main part of the light emitting module of the second embodiment. Compared with the light-emitting module of the first embodiment, the light-emitting module 60 of this embodiment is further provided with an adhesive layer 54 for bonding the filter layer 46 and the LED chip 42 , which is significantly different. The adhesive layer 54 is made of a translucent material with a refractive index of 1.3 or higher. Specifically, fluorine-based adhesives, dimethyl silicone, bisphenol A epoxy resin, TiO 2 Department of sol-gel agents, etc.
[0077] Like the light-emitting module of the first embodiment, when there is an air layer 48 between the filter layer 46 and the LED chip 42, the difference between the refractive index of the air layer 48 and the LED chip 42 is relatively large, so the light output efficiency of the LED chip 42 is limited. room for improvement. By bonding the filter layer 46 and the LED chip 42 with the adhesive...
Embodiment 1-1~ Embodiment 1-3）
[0095] In this example, in image 3 or Figure 4 The light-emitting modules shown in , compare the brightness of semiconductor light-emitting elements by type. In the light-emitting module of Comparative Example 1, the semiconductor light-emitting element is a flip-chip (FC) LED, and does not include a filter layer. In the light-emitting module of Example 1-1, the semiconductor light-emitting element is an FC-type LED and has a filter layer. In the light-emitting module of Embodiment 1-2, the semiconductor light-emitting element is a vertical (VC) LED and has a filter layer. In the light-emitting module of Examples 1-3, the semiconductor light-emitting element is an LD, and a filter layer is provided. It should be noted that the phosphor layer of the light-emitting modules of the comparative example and each example is a glass composition obtained by dispersing powder phosphor, and the thickness is 150 μm.
[0096] Table 1 summarizes the configuration and brightness of the...
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