Cutting device for metal fine tube of high-precision silicon sensor

Abstract

The invention provides a cutting device for the metal fine tube of a high-precision silicon sensor. The cutting device comprises a cutting component for cutting the metal fine tube, a tight resisting component for tightly resisting to the metal fine tube, rotating discs for fixedly mounting the cutting component and the tight resisting component, a positioning component for clamping and positioning the metal fine tube, and a mounting seat for fixedly mounting the positioning component, wherein each rotating disc is sleeved outside the positioning component and is capable of rotating around the positioning component, and the rotating discs are symmetrically arranged on the cutting component and the tight resisting component. According to the cutting device for the metal fine tube of the high-precision silicon sensor, any iron scurf, dusts and steam are not produced during a cutting process, and damage on the chip and the circuit of a sensor by iron scurf, dusts and steam is effectively avoided; and during the cutting process, a cutter is propelled through a fine-toothed threaded screw stem, a feed amount is easily controlled, and the phenomenon of blocking a center hole caused by the edge curling on the inner side of a fine tube due to a large feed amount is prevented.

Description

technical field [0001] The invention relates to a cutting device in the mechanical field, in particular to a cutting device for a thin metal tube of a silicon sensor with high precision. Background technique [0002] At present, the cutting of thin metal tubes for high-precision silicon sensors mainly includes cutting with turning tools on lathes, cutting with traditional saw blades on sawing machines, cutting with grinding wheels on manual grinders or special grinders, and using modern high-tech equipment such as lasers. Cutting machine or electron beam cutting machine cutting and so on. All of the above cutting methods will cause a serious problem, such as cutting on lathes and sawing machines will produce iron filings, manual grinder or automatic grinder will produce dust, laser cutting and electron beam cutting will produce a certain amount of metal vapor . These iron filings, dust and metal vapor can easily contaminate silicon chips and cause short circuits on silicon...

AI Technical Summary

Problems solved by technology

These iron filings, dust and metal vapor can easily contaminate silicon chips and cause short circuits on silicon chips, so traditional and modern cutting methods cannot be used

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