Hybrid unequal space patterned substrate and manufacturing method thereof

A patterned substrate and hybrid technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problem that the effect is not obvious, and achieve the effect of reducing total reflection

Active Publication Date: 2013-04-17
JIANGSU XINGUANGLIAN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

like figure 2 , image 3 As shown, there is a patterned substrate in the prior art, which is to form a number of protrusions 4a arranged in an array on the surface of the basic substrate 3a, and the protrusions 4a are uniformly arranged with the same size and equal spacing. Although the patterned substrate can avoid the generation of total reflection to a certain extent, the effect is not very obvious

Method used

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  • Hybrid unequal space patterned substrate and manufacturing method thereof
  • Hybrid unequal space patterned substrate and manufacturing method thereof
  • Hybrid unequal space patterned substrate and manufacturing method thereof

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Embodiment Construction

[0024] The present invention will be further described below in conjunction with specific drawings.

[0025] Such as Figure 4 ~ Figure 7 As shown: the patterned substrate of the present invention includes a basic substrate 1, and the basic substrate 1 adopts a sapphire substrate, a silicon carbide substrate or other substrates; the front side of the basic substrate 1 is etched to form an array Arranged protruding periods 2; each protruding period 2 includes at least two protruding 2b of different sizes and shapes, and the shape of the protruding 2b is hemispherical, semi-ellipsoidal, conical or pyramidal. The diameter of 2b is 0.1~100μm;

[0026] Such as Figure 4 , Figure 5 As shown, the distance between the bumps 2b in the same bump cycle 2 is not equidistant;

[0027] The height of the protrusions 2b is 0.1-100 μm; the distance between adjacent protrusions 2b is 0.1-100 μm.

[0028] The present invention adopts a number of protrusions of different sizes arranged at d...

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Abstract

The invention relates to a hybrid unequal space patterned substrate comprising a basic substrate. The hybrid unequal space patterned substrate is characterized in that bulge cycles arranged in an array form are formed by etching on the positive surface of the basic substrate, and each bulge cycle comprises at least two bulges with different sizes and shapes. The bulges are in semispherical, semi-elliptic, conical or pyramidal. The diameters of the bulges are 0.1-100 microns. The distances among the bulges of the same bulge cycle are not equal. The basic substrate is a sapphire substrate or a silicon carbide substrate. According to the invention, the surface of the substrate is provided with a plurality of non-equidistant arranged and different-size bulges so that an included angle of light extending out of an out-light surface after being reflected is changed to a larger extent, the generation of full reflection is furthest reduced, and the integral lighting efficiency of the hybrid unequal space patterned substrate disclosed by the invention is improved by 3-10% compared with the integral lighting efficiency of the patterned substrate in the prior art.

Description

technical field [0001] The invention relates to a patterned substrate, in particular to a hybrid patterned substrate with unequal spacing and a preparation method thereof. Background technique [0002] Using patterned substrates instead of traditional planar substrates is a common method to improve the quantum efficiency of LED chips. [0003] Such as figure 1 As shown, because the material of the epitaxial layer 2a is different from the material of the substrate 1a under the epitaxial layer 2a, the epoxy resin material on the epitaxial layer 2a (light-emitting surface) or the light refractive index of air, when the PN junction of the epitaxial layer 2a When emitting light, when the light emitted by it reaches the contact surface (light-emitting surface) with epoxy resin or air, a part of the light will be totally reflected at this interface due to too large incident angle, and then shoot to the lower surface of the epitaxial layer 2a. The lower surface of the epitaxial la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/22H01L33/00
Inventor 张帆吴永胜
Owner JIANGSU XINGUANGLIAN TECH
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