Washing method for groove etching device parts

A technology for etching equipment and parts, which is used in the field of cleaning of groove etching equipment parts, can solve problems such as unfavorable service life extension and operation time extension, and achieves extended service life, procurement and maintenance cost savings and savings The effect of raw material cost

Active Publication Date: 2013-05-08
湖州科秉电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The longer the soaking time, the cleaner the attachments will be removed. When the number of parts is a multiple of the number of tanks, batch operations must be

Method used

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Examples

Experimental program
Comparison scheme
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Example Embodiment

[0017] The present invention will be further described below in conjunction with embodiment:

[0018] The present invention is used for the cleaning method of trench etching equipment parts, comprises the following steps:

[0019] Choose resin sand as the main sand material, adjust the spraying pressure of the sandblasting machine to 0.35Mpa-0.5Mpa; align the sandblasting head of the sandblasting machine with the attachment area on the groove etching equipment parts to be cleaned and start sandblasting , using sand material to shock off the attachments attached to the parts of the groove etching equipment; and then cleaning the attachments with ultrapure water to remove the attachments.

[0020] The above embodiments are only for the purpose of illustrating the present invention, rather than limiting the present invention. Those skilled in the relevant technical fields can also make various changes or modifications without departing from the spirit and scope of the present inv...

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PUM

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Abstract

The invention relates to a washing method of groove etching device parts. The invention relates to a washing method of groove etching device parts. The method comprises the steps that: resin sand is selected as a main sand material; sandblasting machine blasting working pressure is adjusted to 0.35-0.5Mpa; the sand blasting head of the sandblasting machine is aimed at an attachment area on a groove etching device part to be washed, and sand blasting is carried out; attachment attached to the groove etching device part is impacted off by using a sand material; and the attachment is removed through ultrapure water fine washing. With the washing method provided by the invention, base material and anode film layer are not damaged, and a part washing purpose is achieved. Also, working time cost can be saved, and production efficiency can be improved.

Description

technical field [0001] The invention relates to a cleaning method for groove etching equipment parts. Background technique [0002] Trench etching equipment belongs to one form of semiconductor manufacturing equipment and is one of the etching process equipment. This equipment is characterized by a large number of equipment, a variety of process types, and easy process conversion; but the production and maintenance cycle is short, and parts wear and tear are very important The impact of the semiconductor production process is obvious. [0003] Since a layer of anodic film is produced on the surface of the parts of the trench etching equipment, the anodic film will be gradually consumed during the wafer manufacturing process. When the anode film layer on the part is consumed to a certain extent, it will gradually affect the stability of the production equipment, causing adverse consequences in the wafer manufacturing process and affecting product quality. Usually, when this...

Claims

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Application Information

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IPC IPC(8): B24C3/32B24C5/04B24C7/00
Inventor 吕永铭
Owner 湖州科秉电子科技有限公司
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