Integrated method of carbon nano tube heat dissipation structure and electronic device

A heat dissipation structure and technology of electronic devices, applied in the field of microelectronics technology, can solve problems such as reducing production efficiency and increasing process complexity, and achieve the effects of improving production efficiency, avoiding process complexity, and simplifying the process

Inactive Publication Date: 2013-05-08
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

At the same time, in the welding process, the entire piece of carbon nanotubes with the growth substrate and the device need to be welded by reflow soldering, and then the carbon nanotubes and the substrate are separated, which increases the complexity of the process and reduces the production efficiency.

Method used

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  • Integrated method of carbon nano tube heat dissipation structure and electronic device
  • Integrated method of carbon nano tube heat dissipation structure and electronic device
  • Integrated method of carbon nano tube heat dissipation structure and electronic device

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with specific examples, but the present invention is not limited to the following examples.

[0021] A method for integrating a carbon nanotube heat dissipation structure and an electronic device, comprising the following steps:

[0022] 1. Put the 8mm×8mm silicon dioxide chip with aligned carbon nanotube array and the silicon chip with Au thin film heating wire to be integrated into the radio frequency magnetron sputtering equipment, under Ar gas pressure 0.5Pa, power 100W Under the process conditions, a Ni metal target was used to sputter for 60 minutes, so as to deposit a Ni metal wetting layer with a thickness of about 5 microns on the top of the free end of the carbon nanotube and the back of the silicon wafer with the Au film heating wire.

[0023] 2. Place the silicon dioxide wafer with the aligned carbon nanotube array on the hot stage, take three 8mm long Sb60 / Pb40 solder strips, and spread th...

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Abstract

The invention provides an integrated method of a carbon nano tube heat dissipation structure and an electronic device and belongs to the technical field of microelectronic technology. The integrated method of the carbon nano tube heat dissipation structure and the electronic device is simple and highly-effective. A carbon nano tube array is used as the heat dissipation structure, a metal infiltration layer is deposited and a soldering tin layer is manufactured at a free end of the carbon nano tube array, and the carbon nano tube is then peeled off from a growing substrate so as to form a heat dissipation structure body. The soldering tin layer of the heat dissipation structure body is contacted with the metal infiltration layer of the electronic device for heating and soldering so that integration of the carbon nano tube heat dissipation structure and the electronic device is achieved. According to the method of the carbon nano tube heat dissipation structure and the electronic device, a carbon nano heat dissipation structure body with good performance can be directly integrated on the electronic device, and the technical problems that technology is complex and efficiency is low in other integrated methods of carbon nano heat dissipation structures are solved.

Description

technical field [0001] The invention belongs to the technical field of microelectronic technology, and relates to an integration method of a carbon nanotube heat dissipation structure and an electronic device. Background technique [0002] With the development of microelectronic technology, the integration degree of microelectronic devices is getting higher and higher, resulting in an increasing power density inside the device. The huge power density makes the heat dissipation of the device an urgent problem to be solved, so the need for a new structure and process for the heat dissipation of the device is becoming more and more urgent. [0003] Carbon nanotubes have high thermal conductivity (>1000W / mK) and are good heat dissipation materials; therefore, they have broad application prospects in heat dissipation devices for microelectronic devices. In microelectronics process, welding is a common structural connection method, but due to the chemical properties of carbon ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48
Inventor 林媛潘泰松黄振龙曾波高敏
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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