Unlock instant, AI-driven research and patent intelligence for your innovation.

Non-volatile memory unit

A non-volatile storage and voltage technology, applied in electrical components, transistors, electro-solid devices, etc., can solve problems such as inability to integrate

Active Publication Date: 2015-06-24
EMEMORY TECH INC
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, many non-volatile memory processes require stacked gate structures and cannot be integrated into general logic processes
For example, the general semiconductor process only needs to use a single polysilicon layer and there is no special charge-trapping structure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Non-volatile memory unit
  • Non-volatile memory unit
  • Non-volatile memory unit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0082] Please refer to figure 2 and image 3 , figure 2 is a schematic diagram illustrating a non-volatile memory cell 20 for an embodiment of the present invention, and image 3 is for illustration figure 2 A schematic diagram of the circuit diagram of the non-volatile memory cell 20 . Such as figure 2 As shown, the non-volatile memory cell 20 is formed on a P-type or N-type substrate. The non-volatile memory cell 20 includes a floating gate (FG) 200, a control line (CL), a word line (WL) 290, a first source line (SL1), a first bit line (BL1), and a second source line (SL2), and the second bit line (BL2). Taking the P-type substrate as an example, the control line of the non-volatile memory unit 20 includes a first diffusion region 221 and a second diffusion region 222, wherein the first diffusion region 221 and the second diffusion region 222 are formed on the second diffusion region of the first conductivity type. A conductive region (eg, on an N-well (NW)). The...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a non-volatile memory unit. The non-volatile memory unit comprises a coupling device and a first selection transistor. The coupling device is formed in a first conductive area. The first selection transistor is connected in series with a first floating gate transistor and a second selection transistor, wherein the first selection transistor, the first floating gate transistor and the second selection transistor are all formed in a second conductive area. Electrodes of the coupling device and gate electrodes of the first floating gate transistor are integrated floating gate electrodes. The first conductive area and the second conductive area are both formed in a third conductive area, wherein the first conductive area, the second conductive area and the third conductive area are all doped wells. As a result, the non-volatile memory unit is completely compatible with general complementary metal oxide semiconductor processes, only requires a relatively small arrangement area, and demonstrates good write-in and erasing speeds, durability and data memory performance without reducing a circulation speed.

Description

technical field [0001] The present invention relates to a non-volatile storage unit that can be programmed multiple times (multiple time programming, MTP), especially a non-volatile storage unit that is fully compatible with common complementary metal oxide semiconductor manufacturing processes. . Background technique [0002] In the trend of integrating different circuit blocks into a single integrated circuit, the non-volatile memory blocks are also developing towards the integration of logic function blocks. However, many non-volatile memory processes require stacked gate structures, which cannot be integrated into general logic processes. For example, a general semiconductor manufacturing process only needs to use a single polysilicon layer and has no special charge-trapping structure. [0003] US Patent Nos. 7,382,658, 7,391,647, 7,263,001, 7,423,903 and 7,209,392 teach various structures that make up memory cells. US Patent No. 7,382,658 teaches a P-type access tran...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/115H01L29/788
Inventor 徐德训陈纬仁景文澔张文娟
Owner EMEMORY TECH INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More