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Pressure-sensitive adhesive compound, pressure-sensitive adhesive tape, and wafer treatment method

A technology of adhesive and composition, applied in the direction of adhesive heating bonding method, adhesive type, ester copolymer adhesive, etc., which can solve the problems of adhesive burnt adhesion and difficult peeling

Active Publication Date: 2013-05-08
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After such a high-temperature processing process, for example, even if it is a photocurable adhesive described in Patent Document 2, the adhesive will be burnt and adhere to the adherend, or it will be extremely difficult to fix the adhesive although it is not burnt. stripping problem

Method used

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  • Pressure-sensitive adhesive compound, pressure-sensitive adhesive tape, and wafer treatment method
  • Pressure-sensitive adhesive compound, pressure-sensitive adhesive tape, and wafer treatment method
  • Pressure-sensitive adhesive compound, pressure-sensitive adhesive tape, and wafer treatment method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071]Prepare a reactor equipped with a thermometer, a stirrer, and a cooling pipe, add 94 parts by weight of 2-ethylhexyl acrylate, 1 part by weight of acrylic acid, 5 parts by weight of 2-hydroxyethyl acrylate, and 0.01 parts by weight of lauryl mercaptan into the reactor , 80 parts by weight of ethyl acetate, and then the reactor was heated to start reflux. Next, 0.01 part by weight of 1,1-bis(tert-hexylperoxy)-3,3,5-trimethylcyclohexane was added as a polymerization initiator into the reactor, and polymerization was initiated under reflux. Then, 0.01 parts by weight of 1,1-bis(tert-hexylperoxide)-3,3,5-trimethylcyclohexane was added 1 hour and 2 hours after the initiation of the polymerization, and further, in After 4 hours from initiation of polymerization, 0.05 parts by weight of t-hexyl peroxypivalate was added to continue the polymerization reaction. Thereafter, 8 hours after the initiation of the polymerization, an acrylic copolymer having a solid content of 55% by w...

Embodiment 2

[0075] Except having made the compounding quantity of the silicone compound which has a (meth)acryloyl group into 1.5 weight part, it carried out similarly to Example 1, and produced the adhesive composition and the adhesive tape.

Embodiment 3

[0077] Except having made the compounding quantity of the silicone compound which has a (meth)acryloyl group into 2 weight part, it carried out similarly to Example 1, and produced the adhesive composition and the adhesive tape.

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PUM

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Abstract

The present invention aims to provide an adhesive composition which has high initial adhesion and can strongly fix an adherend, while can be peeled off easily by light irradiation even after undergoing a high-temperature process at 200°C or higher. The present invention also aims to provide an adhesive tape produced from the adhesive composition, and wafer treatment method using the adhesive composition. The present invention provides an adhesive composition including an adhesive component, a photoinitiator, and a silicone compound containing a functional group that is crosslinkable with the adhesive component.

Description

technical field [0001] The present invention relates to an adhesive composition which has a high initial adhesive force, can firmly fix an adherend, and can be easily peeled off by irradiating light even after a high-temperature processing process of 200° C. or higher; and using the Adhesive tape of adhesive composition; method of treating wafers using the adhesive composition. Background technique [0002] In the manufacture of semiconductors, in order to facilitate the handling of semiconductors during processing and to prevent damage to them, an operation of affixing semiconductor processing tapes is performed. For example, in the case of grinding a thick-film wafer cut out of a high-purity silicon single crystal to a predetermined thickness to make a thin-film wafer, it can be used for reinforcement by bonding the thick-film wafer to a support plate. Double sided adhesive tape. In addition, an adhesive tape called a dicing tape can also be used when dicing a thin film ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J201/00C09J5/06C09J7/02C09J133/06C09J183/07H01L21/02C09J7/38
CPCC09J7/0207C09J133/02C09J183/04C09J2203/326C09J2483/00C08G77/20C09J2433/00C09J2205/31H01L21/6835H01L2221/68327H01L2221/6834H01L2221/68381C09J7/38C08L83/04Y10T428/2891H01L21/6836C09J2301/416C09J183/06C09J133/10C09J7/385B32B38/10
Inventor 利根川亨麻生隆浩炭井佑一野村茂福冈正辉杉田大平
Owner SEKISUI CHEM CO LTD
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