Control system for desk type reflow soldering machine

Abstract

The invention discloses a control system for a desk type reflow soldering machine. The control system for the desk type reflow soldering machine comprises a controller 1, an upper computer, a solid state relay, a transformer, a switch and a temperature sensor, wherein the solid state relay carries out an automatic adjustment on the power of a heating element under the control of the controller, the transformer carries out the automatic adjustment on the voltage of a hot air machine under the control of the controller 1, the switch is used for control of on-off of an air cooler and the temperature sensor carries out a real-time detection on the temperature inside a furnace of a controlled reflow soldering machine. The solid state relay and the heating element are connected to form a heating system. The transformer and the hot air machine are connected to form a hot air circulating system. The switch and the air cooler are connected to form a refrigerating system. The upper computer, the temperature sensor, the solid state relay, the transformer and the switch are connected with the controller. The control system for the desk-type reflow soldering machine is simple in structure and convenient to operate. A mixed heating mode combined the hot air and an infrared is forcibly used to achieve the welding work under the static state, so the fully automated operation of the whole technique process is achieved.

Description

technical field [0001] The invention relates to a control system, in particular to a control system for a desktop reflow soldering machine. Background technique [0002] The reflow soldering machine is also called a reflow soldering machine or a "reflow oven". It provides a heating environment to melt the solder paste by heat so that the SMD and PCB pads of the surface mount components can pass through the solder paste alloy reliably. devices that are combined together. Before reflow soldering, use a screen printing machine to print an appropriate amount of solder paste on the PCB pad, then use a placement machine to paste the SMD components to the corresponding position, and send the circuit board with the components into the reflow process. In the soldering equipment, the solder paste has experienced drying, preheating, melting, wetting, and cooling to solder the components to the printed board. [0003] The current reflow soldering equipment has disadvantages such as po...

AI Technical Summary

Problems solved by technology

[0003] The current reflow soldering equipment has disadvantages such as poor temperature adjustability, improper heat, low heating efficiency, poor soldering effect on narrow pitch and small SMD components, and cannot be automatically repaired.

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