Improved multi-line cutting device

Abstract

The invention relates to a multi-line cutting device used for multi-line cutting or slicing of solid material. An existing solid material multi-line cutting device is low in cutting efficiency, relatively poor in cutting evenness and high in cost. Based on an improved cutting method, the improved multi-line cutting device is provided, the cutting mode that the solid material to be cut is pressed on a cutting line net from the top to the bottom can be adopted, the cut part and a cutting front edge of the solid material are maintained submerged in cutting liquid, and the effects that in a cutting process, the cutting liquid is even and uniform and has good cutting ability are ensured, cutting efficiency and cutting evenness can be greatly improved, and cutting cost is observably reduced.

Description

technical field [0001] The present invention relates to equipment dedicated to multi-wire cutting, sectioning or slicing of solid materials. Background technique [0002] Existing multi-wire cutting methods dedicated to solid materials, such as but not limited to hard and brittle crystal materials including silicon and aluminum oxide, usually include the steps of: using a single or multiple cutting wires arranged through a wiring system to contain at least 2 The cutting wire net of the first cutting line enables the cutting line to make the cutting movement while making the object to be cut contact with the cutting line net on the cutting side. Or the cutting effect of the abrasive mortar to realize the cutting of the object to be cut, including the sectioning of the ingot, or slicing, and so on. Wherein, the cutting line and the position of the object to be cut can be distinguished as when starting cutting, the cutting side cutting line is positioned above the object to be...

AI Technical Summary

Problems solved by technology

Although this technical solution can greatly improve the degree of mortar pouring at the cutting front, it is only applicable to the method of cutting the cutting line from the top to the bottom of the crystal to be cut, and it is difficult to adapt to the situation of multi-line slicing. In the process, the side wall of the liquid holding tank is cut and damaged at the same time. At the same time, because the liquid leaks through the line groove on the side wall of the liquid holding tank along the cutting line, the liquid level in the liquid holding tank is also difficult to maintain stably at the level of the cutting edge. , which affects the improvement of the cutting effect; while immersing the entire silicon crystal to be cut needs to maintain a relatively deep liquid depth. For the case of relying on mortar cutting, due to the increased settlement of the cutting sand, the cutting of the mortar carried by the cutting line is reduced. ability

Images