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Substrate material loading assembly, substrate loading and unloading device and plasma enhanced chemical vapor deposition (PECVD) device

A technology for substrates and components, applied in metal material coating process, gaseous chemical plating, coating, etc., can solve the problems of reducing work efficiency and slow feeding speed, and achieves increasing feeding efficiency, improving efficiency, increasing effect of quantity

Active Publication Date: 2015-01-14
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditionally, because the gantry has finished loading and unloading the substrate, the loading table is still being loaded by the loading manipulator on the feeding conveyor belt, so the gantry can only wait for the loading to be completed before transferring the substrate to the loading table. board, so the loading speed is slow, greatly reducing work efficiency

Method used

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  • Substrate material loading assembly, substrate loading and unloading device and plasma enhanced chemical vapor deposition (PECVD) device
  • Substrate material loading assembly, substrate loading and unloading device and plasma enhanced chemical vapor deposition (PECVD) device
  • Substrate material loading assembly, substrate loading and unloading device and plasma enhanced chemical vapor deposition (PECVD) device

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Embodiment Construction

[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0028] In describing the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship indicated by "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or positional relationship. Elements must have certai...

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Abstract

The invention discloses a substrate material loading assembly, a substrate loading and unloading device and a plasma enhanced chemical vapor deposition (PECVD) device. The substrate material loading assembly comprises a material box, a material loading conveyor, and a material loading mechanical hand. A box cavity used for storing substrates is formed inside the material box, the substrates are arranged into a plurality of layers along the vertical direction of the material box, and the substrates are arranged into a plurality of rows along the left-right direction of the material box. The material loading conveyor is used for conveying the substrates, the material loading mechanical hand comprises a support, an arm and a plurality of substrate absorption parts, one end of the arm is connected with the support, the plurality of substrate absorption parts are arranged on the arm and are spaced along the length direction of the arm, so that the material loading mechanical hand can simultaneously absorb the plurality of substrates out of the plurality of rows of the substrates on the same layer inside the material box and can place the plurality of substrates on the material loading conveyor. According to the substrate material loading assembly, material loading efficiency can be improved, and accordingly integral working efficiency is improved.

Description

technical field [0001] The invention relates to a substrate loading assembly, a substrate loading and unloading device and PECVD equipment. Background technique [0002] In the field of substrate processing, for example, in the plasma enhanced chemical vapor deposition (PECVD) system, the substrate is loaded on the carrier plate in the loading table area, and enters the preheating chamber for preheating treatment. When the substrate reaches the process temperature requirement After that, it is transferred to the process chamber for PECVD process, and then transferred out of the chamber system from the cooling chamber to the unloading station. The unloading platform and the loading platform can be raised and lowered. After the unloading platform lowers the carrier plate to the lower layer, it is transferred to the recovery system, and then transferred to the bottom of the loading platform, and then lifted to the upper layer of the loading platform for the next cycle. [0003...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/54C23C16/44
Inventor 卢川
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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