Packaging structure of thermo-electric pile detector and signal processing circuit
A technology for signal processing circuits and thermopile detectors, applied in the direction of electric radiation detectors, circuits, measuring devices, etc., can solve problems such as the inability to use wafer-level packaging and the large volume of integrated devices, so as to reduce parasitic effects and The effect of small lead distance and cost reduction
Active Publication Date: 2013-06-26
中科芯未来微电子科技成都有限公司
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Problems solved by technology
Such integrated devices are bulky and cannot be packaged at the wafer level. The cost of metal packaging materials and processes and infrared transmission windows account for a considerable proportion of the cost of infrared detectors.
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[0017] The present invention will be further described below in conjunction with specific drawings and embodiments.
[0018] The core packaging structure of the thermopile detector and signal processing circuit proposed by the present invention is as follows: figure 1 shown.
[0019] Thermopile detectors (i.e. figure 1 The infrared detector 1) is manufactured by using the existing micro-electromechanical (MEMS) processing technology. The infrared detector 1 includes a first substrate 12, a cavity structure 14 located in the first substrate 12, and a front surface of the first substrate 12. Suspension film 13, made thermopile structure 15 in suspension film 13 by existing technology, one end of described thermopile structure 15 is hot end 151, and the other end is cold end 152, and thermopile structure 15 is usually made of a series of thermal The even bars are connected in series; the lead electrodes 16 electrically connected to the thermopile structure 15 protrude from the ...
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The invention provides a packaging structure of a thermo-electric pile detector and a signal processing circuit. The packaging structure of the thermo-electric pile detector and the signal processing circuit comprises an infrared detector and the signal processing circuit, the front face of the infrared detector faces the signal processing circuit, the infrared detector is overlaid above the signal processing circuit in a back-off mode, a first electric conduction protruding point of the front face of the infrared detector is in contact connection with a second electric conduction protruding point at a corresponding position of the signal processing circuit, and therefore the electrical connection between the infrared detector and the signal processing circuit is enabled to be achieved. The infrared detector comprises a first substrate, a cavity structure located in the first substrate, a suspension film located on the front face of the first substrate, and a thermo-electric pile structure located in the suspension film, one end of the thermo-electric pile structure is a hot end, the other end of the thermo-electric pile structure is a cold end, a lead electrode electrically connected with the thermo-electric pile structure protrudes out of the suspension film, and the first electric conduction protruding point is arranged on the lead electrode. The packaging structure avoids an infrared transmission window used in a traditional packaging technology, effectively lowers cost, reduces a parasitic effect and improves performance.
Description
technical field [0001] The invention relates to a microelectronic packaging technology, in particular to an integration technology of a thermopile infrared detector and a signal processing circuit thereof. Background technique [0002] Infrared detectors are one of the most critical components in an infrared system. The thermopile infrared detector is an uncooled infrared detector developed earlier. Its working principle is based on the Seebeck effect, in which a temperature difference between two different electrical conductors or semiconductor materials results in a voltage difference between the two materials. Because thermopile infrared detectors have the advantages of small size, can work at room temperature, wide-spectrum infrared radiation response, can detect constant radiation, and low manufacturing cost, they are widely used in safety monitoring, medical treatment, life detection, etc. [0003] Early thermocouples were made of metal filaments, such as copper-cons...
Claims
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Login to View More IPC IPC(8): B81B7/00B81B7/02G01J5/20
Inventor 孟如男秦毅恒王玮冰
Owner 中科芯未来微电子科技成都有限公司