Package structure of thermopile detector and signal processing circuit
A signal processing circuit, thermopile detector technology, applied in the direction of electrical radiation detectors, circuits, measuring devices, etc., can solve the problems of large integrated devices and inability to use wafer-level packaging, etc., to reduce lead distance, reduce Small parasitic effect, cost reduction effect
Active Publication Date: 2016-01-06
中科芯未来微电子科技成都有限公司
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Problems solved by technology
Such integrated devices are bulky and cannot be packaged at the wafer level. The cost of metal packaging materials and processes and infrared transmission windows account for a considerable proportion of the cost of infrared detectors.
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[0017] The present invention will be further described below in conjunction with specific drawings and embodiments.
[0018] The core packaging structure of the thermopile detector and signal processing circuit proposed by the present invention is as follows: figure 1 shown.
[0019] Thermopile detectors (i.e. figure 1 The infrared detector 1) is manufactured by using the existing micro-electromechanical (MEMS) processing technology. The infrared detector 1 includes a first substrate 12, a cavity structure 14 located in the first substrate 12, and a front surface of the first substrate 12. Suspension film 13, made thermopile structure 15 in suspension film 13 by existing technology, one end of described thermopile structure 15 is hot end 151, and the other end is cold end 152, and thermopile structure 15 is usually made of a series of thermal The even bars are connected in series; the lead electrodes 16 electrically connected to the thermopile structure 15 protrude from the ...
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The invention provides a thermopile detector and signal processing circuit packaging structure, which includes an infrared detector and a signal processing circuit. The front side of the infrared detector faces the signal processing circuit, and the infrared detector is overlaid on top of the signal processing circuit. Infrared detection The first conductive bump on the front side of the device is in contact with the second conductive bump at the corresponding position on the signal processing circuit; thereby electrically connecting the infrared detector and the signal processing circuit. The infrared detector includes a first substrate, a cavity structure located in the first substrate, a suspended film on the front side of the first substrate, and a thermopile structure located in the suspended film. One end of the thermopile structure is a hot end. , the other end is the cold end; the lead electrode electrically connected to the thermopile structure protrudes from the suspended film, and the first conductive bump is arranged on the lead electrode. This packaging structure avoids the infrared transmission window used in traditional packaging technology, effectively reduces costs, reduces parasitic effects, and improves performance.
Description
technical field [0001] The invention relates to a microelectronic packaging technology, in particular to an integration technology of a thermopile infrared detector and a signal processing circuit thereof. Background technique [0002] Infrared detectors are one of the most critical components in an infrared system. The thermopile infrared detector is an uncooled infrared detector developed earlier. Its working principle is based on the Seebeck effect, in which a temperature difference between two different electrical conductors or semiconductor materials results in a voltage difference between the two materials. Because thermopile infrared detectors have the advantages of small size, can work at room temperature, wide-spectrum infrared radiation response, can detect constant radiation, and low manufacturing cost, they are widely used in safety monitoring, medical treatment, life detection, etc. [0003] Early thermocouples were made of metal filaments, such as copper-cons...
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IPC IPC(8): H01L35/28H01L31/00B81B7/00G01J5/20H10N10/10
Inventor 孟如男秦毅恒王玮冰
Owner 中科芯未来微电子科技成都有限公司