Adhesive composition for semiconductor, adhesive film and semiconductor device

A technology for adhering films and semiconductors, applied in the direction of semiconductor devices, films/sheets without carriers, film/sheet adhesives, etc. The effect of improving manufacturing efficiency and productivity

Inactive Publication Date: 2013-07-03
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] PCB bake process, PCB plasma process, post-cure process (or semi-cure or B-stage process) and mold post-cure process are all separate processes, which make it difficult to reduce time and number of workers, thereby reducing productivity

Method used

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  • Adhesive composition for semiconductor, adhesive film and semiconductor device
  • Adhesive composition for semiconductor, adhesive film and semiconductor device
  • Adhesive composition for semiconductor, adhesive film and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-2

[0099] Examples 1-2: Preparation of Adhesive Compositions for Semiconductors

[0100] Add the solvent (cyclohexanone) to the thermoplastic resin, epoxy resin, phenolic curing agent, amine curing resin, curing accelerator, filler and silane coupling agent as listed in Table 1 so that the solid content in the solution is 20wt %, and then fully kneaded with a ball mill to prepare an adhesive composition for semiconductors.

experiment example

[0118] Experimental Example: Evaluation of Physical Properties of Adhesive Films Prepared Using the Adhesive Compositions of Examples and Comparative Examples

[0119] The physical properties of the respective adhesive films prepared using the adhesive compositions of Examples 1 and 2 and Comparative Examples 1, 2 and 3 were evaluated by the following methods, and the results are shown in Table 2.

[0120] Table 2

[0121]

[0122] (1) Chip shear strength: A 530 μm thick wafer was cut into chips having a size of 5 mm×5 mm. These chips were laminated with each adhesive film at 60°C and cut to leave only bonded parts. An upper chip having a size of 5 mm×5 mm was placed on a wafer having a size of 10 mm×10 mm, and then a force of 10 kgf was applied on a hot plate at 120° C. for 5 seconds. The chip shear strength was then measured with DAGE4000, and the results are shown in Table 2.

[0123] (2) Curing initiation temperature: The heat generated by the adhesive composition p...

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Abstract

The invention relates to an adhersive composition for a semiconductor, an adhesive film and a semiconductor device. More specifically, the invention relates to the adhersive composition. Through highly adhersive features of the adhersive composition, a PCB curing process and a PCB plasma process can be omitted through improvement of the curing rate, and partial curing, if being applied to an on-line process, can be conducted during a lead adhesion process so as to reduce the process time, so that a curing process (or a semi-curing process or a B step) can be omitted or minimized. For the adhersive composition, phenolic film and amine-cured resin both serve as curing agents to allow the curing process to be omitted or minimized, and an imidazole curing agent or a micro-capsule potential curing agent is adopted to serve as the curing agent so that the curing rate is improved.

Description

technical field [0001] The present invention relates to an adhesive composition for semiconductors and an adhesive film comprising the composition. More specifically, the present invention relates to an adhesive composition, which can make PCB baking process and PCB plasma process omit through the improvement of curing rate by utilizing high adhesive properties, and in order to reduce process time in wire The bonding process is partially cured by applying it to an in-line process, allowing the curing process (or semi-curing or B-stage) to be omitted or reduced. For the adhesive composition of the present invention, a phenolic resin and an amine curing resin are jointly used as a curing agent to allow the omission or reduction of the curing process, and an imidazole curing agent or a microcapsule type latent curing agent is used as a curing agent to increase the curing rate . Background technique [0002] High capacity of semiconductor devices can be achieved in terms of ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J201/00C09J163/00C09J161/06C09J11/06H01L23/488C09J7/10
CPCC08K5/18C09J163/00C09J2203/326C09J2400/22C09J2461/00C09J2463/00C08L61/06C08G59/50C08G59/621H01L24/29H01L24/32H01L2224/2919H01L2224/2929H01L2224/29339H01L2224/29344H01L2224/29347H01L2224/29355H01L2224/29386H01L2224/29387H01L2224/29388H01L2224/83851H01L2224/83862H01L2224/32145H01L2224/32225C08K5/0025C09J7/10C09J2301/312C09J2301/408H01L2924/0665H01L2924/00014C09J7/30C09J11/06
Inventor 魏京台金相珍金哲洙梁承龙崔裁源
Owner CHEIL IND INC
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