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Semiconductor refrigerating device

A refrigeration device and semiconductor technology, applied in refrigerators, refrigeration and liquefaction, machines using electric/magnetic effects, etc., can solve problems affecting refrigeration efficiency and achieve one-way guidance, improve refrigeration efficiency, and ensure reliability Effect

Active Publication Date: 2015-04-15
JIAXING MODULE BONDING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the volume limitation of the semiconductor refrigeration chip, its thermal effect surface and cold effect surface are relatively close, and it is easy to generate mutual heat exchange during operation, thus affecting the cooling efficiency.

Method used

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  • Semiconductor refrigerating device

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Embodiment Construction

[0021] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0022] see figure 1 , the embodiment of the present invention includes:

[0023] A semiconductor refrigeration device, comprising: a semiconductor refrigeration sheet 10 , a heat insulation structure, a metal sheet 30 , a set of heat pipes 40 , a set of heat dissipation fins 50 , a metal block 60 and a plane heat conducting material 70 .

[0024] The semiconductor cooling chip 10 has a thermal effect surface 11 and a cold effect surface 12 .

[0025] The heat insulation structure isolates the heat effect surface 11 and the cold effect surface 12 of the semiconductor refrigeration chip 10; includes a heat insulation layer, and the heat insulation...

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Abstract

The invention discloses a semiconductor refrigerating device which comprises a semiconductor refrigerating plate, an insulation structure, a metal plate, a group of heat tubes, and a group of radiating fins. The semiconductor refrigerating plate is provided with a heating effect side and a cooling effect side. The heating effect and cold effect sides of the semiconductor refrigerating plate are isolated by the insulation structure. The upper surface of the metal plate is tightly attached to the cooling effect side of the semiconductor refrigerating plate. The lower surface of the metal plate contacts with liquid to be cooled. The first end of every heat tube is attached to the heating effect side of the semiconductor refrigerating plate, and the second end of every heat tube extends out of the insulation structure. The radiating fins are mounted at the second ends of the heat tubes. The heating effect and cooling effect sides of the semiconductor refrigerating plate of the semiconductor refrigerating device are fully isolated, heat is transmitted out from the closed hot ends of the heat tubes and is dissipated by the external radiating fins, and accordingly refrigerating efficiency of the semiconductor refrigerating device is increased greatly. In addition, the made cover structure is convenient to apply to vessels with the either end opened.

Description

technical field [0001] The invention relates to the refrigeration field, in particular to a semiconductor refrigeration device. Background technique [0002] At present, in addition to the commonly used compression refrigerators and the gradually promoted absorption refrigerators and steam jet refrigerators, the use of semiconductor refrigeration chips is becoming more and more extensive. A semiconductor cooler, also called a thermoelectric cooler, is a heat pump. Its advantage is that there are no sliding parts, and it is used in some occasions where the space is limited, the reliability is high, and there is no refrigerant pollution. However, due to the volume limitation of the semiconductor refrigeration chip, its thermal effect surface and cold effect surface are relatively close, and it is easy to generate mutual heat exchange during operation, thereby affecting the cooling efficiency. In addition, the cooling efficiency of the cold effect surface also depends on the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B21/02
CPCF25B2321/023
Inventor 汪波龚涛汪洋姚国春
Owner JIAXING MODULE BONDING TECH CO LTD
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