Unlock instant, AI-driven research and patent intelligence for your innovation.
Mushroom culture material and preparation method thereof
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A compost and shiitake mushroom technology, applied in fertilizer mixture, fertilization device, application, etc., can solve the problems of long planting cycle, long mycelium growth cycle, infection, etc., and achieve the effect of saving resources
Inactive Publication Date: 2013-09-11
ANHUI AGRICULTURAL UNIVERSITY
View PDF7 Cites 10 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0003] The traditional shiitake mushroom culture method has a long mycelial growth cycle and low density, which causes a certain degree of infection. Although a certain temperature difference is required, the mycelial growth is slow or stops when the temperature is too low, resulting in a long planting cycle.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Examples
Experimental program
Comparison scheme
Effect test
Embodiment example 1
[0024] According to the weight ratio, mix 13% bran, 40% wood chips, 3% gypsum, 40% seed hulls, 3% mugwort excipients, and 1% sugar, and add water to stir so that the weight ratio of material to water is 1:1.0 .
[0025] Put the above-mentioned mushroom culture material into bags (35CM*17CM, 2 silk thick), immediately tie the mouth of the bag tightly and put it in a pot, and sterilize at 90-100°C for 10-12 hours. After cooling, inoculate in a sterile environment. The inoculated cultivation material is piled up in the shape of a "well" with a height of 5-6 layers, placed in an environment of 20-27°C (average 25°C) and relative air humidity of 65%. nourish. After 20 days, pierce the outer bag to increase oxygen, and after 30 days, the mycelium is overgrown, and the bag can be removed.
[0026] After the shiitake mushrooms are taken out of the bag, the mushroom sticks are made. The mushroom sticks are placed in the fruiting room, and the relative humidity of the air is kept at 8...
Embodiment example 2
[0028] According to the weight ratio, 18% of bran, 40% of sawdust, 1% of gypsum, 35% of seed husk, 5% of mugwort excipients, and 1% of sugar are evenly mixed, and mixed with water, so that the weight ratio of material to water is 1:1.2 .
[0029] The rest are the same as implementation case 1.
Embodiment example 3
[0031] According to the weight ratio, 23% of bran, 35% of wood chips, 2% of gypsum, 30% of seed hulls, 7% of mugwort auxiliary materials, and 3% of sugar.
[0032] The rest are the same as implementation case 1.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
PUM
Login to View More
Abstract
The invention discloses a mushroom culture material, comprising wheat bran, wood chip, gypsum, seed husk and a mugwortadjuvant material, wherein the mugwortadjuvant material accounts for 3 to 7% of the mushroom culture material. The invention further discloses a preparation method for the mushroom culture material. The preparation method comprises the following steps: uniformly mixing wheat bran, wood chip, gypsum, the mugwortadjuvant material, seed husk and sugar, adding water and carrying out stirring to allow a material-water weight ratio to be 1: 1.0 to 1: 1.5. The invention has the following advantage: since mugwort is used as a component of the adjuvant material for preparation of the mushroom culture material, a good mushroom culture effect is obtained.
Description
technical field [0001] The invention relates to a shiitake mushroom compost, which is mainly used in the technical field of shiitake mushroom cultivation. Background technique [0002] The compost of shiitake mushrooms is mainly made of miscellaneous wood chips, cottonseed hulls, bran, etc., with sugar and gypsum as auxiliary materials. After mixing well, put them into cylindrical plastic bags, inoculate them after sterilization, and cultivate them at 20-25°C for about 60 days. The hyphae are overgrown and form fruiting bodies, and the temperature and humidity are controlled to take off the bag and continue to cultivate, and can be collected after about 10 days. [0003] The traditional shiitake mushroom culture method has a long myceliumgrowth cycle, and low density causes a certain degree of infection. Although a certain temperature difference is required, the mycelium grows slowly or stops growing at too low a temperature, resulting in a long planting cycle. Contents o...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to View More 
Login to View More 
