Unlock instant, AI-driven research and patent intelligence for your innovation.

High-modal small-mass bearing piece platform of photoetching machine

A technology for a wafer stage and a lithography machine, which is applied in the field of lithography machines, can solve problems such as difficulty in improving and complicated manufacturing processes, and achieve the effects of reducing manufacturing risks, controlling processing costs, and reducing quality

Active Publication Date: 2015-04-15
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the irregular geometric shape and size of the bottom reinforcement to the rib plate, the manufacturing process is relatively complicated, and the ratio of mode and mass designed according to this method has approached the limit, and it is difficult to improve

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-modal small-mass bearing piece platform of photoetching machine
  • High-modal small-mass bearing piece platform of photoetching machine
  • High-modal small-mass bearing piece platform of photoetching machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] In order to better understand the technical content of the present invention, specific embodiments are given together with the attached drawings for description as follows.

[0037] This patent relates to the invention of a light-weight perforated wafer carrier for a lithography machine. like figure 1 Shown is a schematic diagram of the structure of the micro-motion stage of the workpiece table, wherein the carrier 1 is the main structural part of the micro-motion stage, the carrier 1 is installed on the top of the micro-motion stage, and the plane vector motor 2, the vertical drive mechanism 3 and the Differential sensor4.

[0038] Please refer to figure 2 figure 2 Shown is a cross-sectional view of the internal structure of the wafer table in a preferred embodiment of the present invention. The present invention proposes a high-mode light-weight wafer carrier for a lithography machine, including: a top structure module 11 of the wafer platform and a sealing plat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a high-modal small-mass bearing piece platform of a photoetching machine. The bearing piece platform comprises a top structural module of the bearing piece platform and a bottom sealing plate of the bearing piece platform, wherein the top structural module of the bearing piece platform and the bottom sealing plate of the bearing piece platform are adhered into a whole so as to form two upper and lower layers of sandwich board structures; the top structural module of the bearing piece platform is provided with a plane vector motor mounting cavity, a vertical driving mechanism mounting cavity, a differential sensor mounting cavity and a lightening hole; the bottom sealing plate of the bearing piece platform is provided with an open pore to fit for the assembly of the bearing piece platform and a microchecker. The high-modal small-mass bearing piece platform of the photoetching machine, provided by the invention, can effectively reduce the weight of the structure and materials and lighten the mass of a bearing piece, and meanwhile, the modal value index and the dynamic performance of a workpiece platform are ensured.

Description

technical field [0001] The invention relates to the field of lithography machines, and in particular to a high-mode and light-weight substrate for a lithography machine. Background technique [0002] The wafer carrier is one of the most important parts of the photolithography machine workpiece table, which is used to carry the silicon wafer. In the magnetic levitation workpiece table, the drive of the micro-motion table of the workpiece table is realized by a planar motor, and due to the pursuit of lithography efficiency, a higher motion acceleration requirement is put forward for the workpiece table. However, in order to increase the acceleration of the workpiece table, according to Newton's law F=Ma, there are two methods: 1) increasing the drive output of the planar motor; 2) reducing the weight of the micro-motion table itself. Under the current technical conditions of the industry, it is very difficult to improve the drive output of planar motors, and the development a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 吴飞郭琳王保亮马宁袁志扬刘育韩良华
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD