Quick efficient wafer back defect identification method

Abstract

The invention discloses a quick efficient wafer back defect identification method. The method includes the steps: establishing a graphical information database stored with graphical information data; converting pictures of wafer back defects found on line into digital analog pictures; inputting wafer back defect feature data in the digital analog pictures into the graphical information database; and automatically searching graphical information data stored in the graphical information database by the graphical information database according to the wafer back defect feature data so as to search graphical information data with the highest matching degree with the wafer back defect feature data. By the method, reasons for wafer back defects can be searched automatically and quickly, influences of the defects on normal production are reduced, process quality is controlled, and product yield is improved; meanwhile, cost of production is lowered, and set detection stations for wafer backs can be decreased to reduce labor and process cost.

Description

technical field [0001] The invention relates to a wafer backside defect detection method, belonging to the technical field of integrated circuit manufacturing technology, in particular to a fast and efficient wafer backside defect identification method. Background technique [0002] With the development of integrated circuit technology and the scaling down of scale, the process complexity of modern integrated circuit production lines is getting higher and higher, and the defect on the backside of the wafer has an increasing impact on the yield. According to the current production experience, More than 90% of the defects of a certain shape on the backside of the wafer have a one-to-one correspondence with the graphic features of some related parts of the equipment. If it is necessary to find out the problematic process and machine, a large amount of data comparison and analysis needs to be carried out. However, at present, the defect monitoring for the backside of the wafer i...

AI Technical Summary

Problems solved by technology

[0005] In view of the above existing problems, the present invention discloses a fast and efficient crystal back defect identification method to overcome the problems in the prior art that it is difficult to find and analyze defects on the back of the wafer and seriously affect production

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