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A flexible substrate packaging structure

A flexible substrate and packaging structure technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of complex processing, complex manufacturing process, difficult and high-density wiring, etc.

Inactive Publication Date: 2016-01-27
CHANGZHOU RODEK ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The use of ceramic substrate packaging has the characteristics of high frequency, high temperature is not easy to deform, and good performance, but on the other hand, the cost of ceramic substrate packaging is high, the manufacturing process is complicated, and the processing is more complicated.
In recent years, the properties of organic substrates, flexible substrates and organic-inorganic materials combined with composite substrates have made great progress in terms of high-frequency characteristics. In the existing technology, the connecting wires are often connected after the sensor package is completed, which is prone to electromagnetic interference and difficult high density wiring

Method used

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Embodiment 1

[0023] Such as Figure 1 to Figure 2 As shown, it is a flexible substrate packaging structure of the present invention, including a flexible substrate 1 board and a number of packaging units 2 arranged on the flexible substrate through a resin packaging structure. The flexible substrate is a multi-layer flexible substrate, that is, the flexible substrate 1 is a metal And polymer materials, multi-layer structures made of thick film, thin film and other technologies. The packaging unit 2 leads out a flexible connection wire 4 . Specifically, a plurality of packaging units 2 are isolated and packaged on the entire flexible substrate 1 , that is, each packaging unit 2 is individually packaged with injection molding resin.

[0024] There is a gap d between the packaging units 2, 5mm≤d≤10mm. The thermal expansion coefficient of the flexible substrate in the X, Y, and Z directions is different from that of the resin in the X, Y, and Z axes. The large-area flexible substrate 1 and t...

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Abstract

The invention discloses a flexible substrate packaging structure. The flexible substrate packaging structure comprises a flexible substrate and a plurality of packaging units which are arranged on the flexible substrate through resin packaging structures, and flexible connecting wires are led out by the packaging units. The packaging units and external connecting wires are made to be capable of being mutually connected in high density. The technical problems that in the prior art, due to the fact that the connecting wires are led out after packaging is completed, electromagnetic interference easily occurs and the wires are difficult to distribute in high density are solved. The flexible substrate packaging structure is suitable for the field of electronic packaging.

Description

【Technical field】 [0001] The invention relates to a flexible substrate packaging structure. 【Background technique】 [0002] In the current electronic packaging project, there are many ways to realize electronic resin packaging. For example, the more popular DIP (dual in-line package, DualIn-linePackage), SOP (small outline package, SmallOut-LinePackage), QFP (square flat package, PlasticQuadFlatPackage), BGA (ball grid array package) , BallGridArray), CSP (chip-scale packaging, ChipScalePackage), recently developed MCM (multi-chip module packaging multi-chipmodule), SIP (system-level packaging, SystemInaPackage), SOP packaging and so on. In particular, MCM and SIP packages are suitable for high-speed digital and high-frequency analog circuits, and have been widely used in various system fields of communication, radar, navigation and home appliances. Especially the MCM package is to interconnect and assemble integrated circuit bare chips and other micro-components on the sa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/552
CPCH01L2224/32225H01L2924/15174H01L2924/181H01L2924/19105
Inventor 高凯
Owner CHANGZHOU RODEK ELECTRONICS TECH