Heat sink and manufacturing method thereof

Abstract

The invention relates to a radiating fin which comprises a metal substrate having an upper surface and a lower surface. The upper surface or the lower surface of the metal substrate is coated with a layer of epoxy resin, or the upper and lower surfaces of the metal substrate are both coated with a layer of epoxy resin. A layer of thermally conductive nanoparticles is formed on the layer of epoxy resin. The invention also relates to a manufacturing method of the radiating fin. The radiating fin provided by the invention has the advantages of good radiating effect, relatively low cost and simple structure. The manufacturing method of the radiating fin is also not complicated.

Description

technical field [0001] The invention relates to a heat dissipation device and a manufacturing method thereof, in particular to a heat dissipation sheet with a nano particle layer and excellent heat dissipation performance and a manufacturing method thereof. Background technique [0002] With the rapid development of semiconductor device integration technology and LED lighting, the integration of semiconductor devices is getting higher and higher. However, the volume of devices is getting smaller and smaller, and their demand for heat dissipation is getting higher and higher. Important issues. In order to meet this need, various heat dissipation methods such as fan heat dissipation, water-cooled auxiliary heat dissipation, and heat pipe heat dissipation are widely used, and a certain heat dissipation effect has been achieved. Two-thirds, there is no ideal contact interface, which fundamentally affects the heat transfer effect of the semiconductor device to the heat sink. The...

AI Technical Summary

Problems solved by technology

The general defect of this type of material is that the thermal conductivity of the overall material is small, with a typical value of 1 watt / meter Kelvin (W / mK), which can no longer meet the heat dissipation requirements of the increased integration of semiconductors.

In addition, by increasing the content of heat-conducting particles in the polymer matrix, so that the particles contact each other as much as possible, the overall thermal conductivity of the composite material can be increased. For example, the thermal conductivity of some special interface materials can reach 4-8 W / m·Kelvin (W / mK), however, when the content of thermally conductive particles in the polymer matrix increases to a certain level, the polymer matrix will lose its original properties, such as the oil will become hard, so the infiltration effect will become worse, and the rubber will become harder, so that Loss of proper flexibility, which will greatly reduce the performance of thermal interface materials

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