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Fixing device for electrode processing

The technology of fixing device and electrode is applied in the field of latent gate electric spark of injection mold and fixing device of processing electrode, which can solve the problems of difficulty in ensuring size and position accuracy, the electrode cannot be reused, and it takes a long time, and achieves a compact structure. , The effect of ingenious design and convenient processing

Inactive Publication Date: 2013-11-06
TIANJIN ZHONGHUAN SANFENG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With this processing method, the clamping of the mold workpiece is based on the ridgeline of the workpiece, which makes alignment very inconvenient, time-consuming, low in efficiency, and difficult to guarantee the size and position accuracy, while the electrode clamping is based on the sharp point of the electrode. After discharge, the reference is lost due to sharp point loss, so the electrode cannot be reused, and the waste is serious

Method used

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  • Fixing device for electrode processing
  • Fixing device for electrode processing
  • Fixing device for electrode processing

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Embodiment Construction

[0014] The present invention will be further described below in conjunction with the accompanying drawings.

[0015] As shown in the figure, a fixing device for processing electrodes includes base 1, locking rod 2, EROWA positioning piece 3, bearing 4, square nut 5, shoulder bolt 6, pin 7, and EROWA positioning piece 3 through four positioning screws It is fixed under the base 1. A small round hole 11 and a large round hole 12 are respectively provided at the central symmetrical positions of the two U-shaped sides of the base 1. The small round hole 11 is also provided with a square groove 13 outside the center of the upper part of the two U-shaped sides. There is a pin hole 14, with the pin hole 14 and the vertical side of the base 1 as the axis, a plurality of angle holes 15 are arranged symmetrically along both sides of the pin hole 14, the bearing 4 is installed in the large round hole 12, and the square nut 5 is installed in the square groove 13. The upper part of the loc...

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Abstract

The invention relates to a fixing device for electrode processing by adopting the injection mold submarine gate electric spark. The EROWA locating plate of the fixing device is fixed at the lower part of a base, a small circular hole and a big circular hole are formed in the central symmetry positions of two U-shaped side surfaces of the base respectively, pin holes are formed in the central positions of the upper parts of the U-shaped side surfaces of the base, by taking the perpendicular edges of the base and the pin holes as the axis, a plurality of angle holes are symmetrically formed along the two edges of each pin hole, a bearing is mounted in the big circular hole, square nuts are mounted in square grooves, an upper through hole and a lower through hole are formed in the upper part of a locking lever, a shoulder bolt is matched with the bearing and the square nuts through the lower through hole to tightly fix a locking rod on the base, side plane surfaces of the locking rod are oppositely fitted with the U-shaped inner side surfaces for positioning, and a pin fixes the locking rod in the different positions in different angles through the upper through hole. The device has the advantages that the design is artistic, the operation is stable, the structure is compact, the processing operation is convenient, and the adjustable angle of the electrode is enlarged, so that the processing accuracy and consistency of the submarine gate are ensured, the work difficulty of operators is reduced, the processing cost of a die is reduced, and the application scope is wide.

Description

technical field [0001] The invention relates to the field of injection mold processing, in particular to a fixing device for a processing electrode of an injection mold latent gate EDM. Background technique [0002] At present, due to the higher and higher requirements on the appearance of electronic products and the superiority of production automation, more and more injection molds adopt the structure of latent gate. The inner surface or the hidden place on the side, or set on the ribs and columns that cannot be seen on the surface of the product, this gate structure will not leave spray marks and air marks on the surface of the product during the molding process, so as to ensure that the plastic product The appearance is smooth and bright, and when the plastic product is ejected, it will be automatically broken off from the waste, and it is easy to realize production automation and is widely used. However, because the latent gate sneaks under the parting surface and ente...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23H7/26
Inventor 王懿徐力闫丽丽孙乃涛牛莉
Owner TIANJIN ZHONGHUAN SANFENG ELECTRONICS
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