Substrate cutting device and substrate cutting method
A cutting device and cutting method technology, applied in glass cutting device, glass manufacturing equipment, laser welding equipment and other directions, can solve the problems of excessive process time and cost, affecting cutting quality, consumption, etc., to save process time and cost, The effect of improving the cutting quality
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[0048] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments capable of implementing the present invention. These embodiments are described in detail so that those skilled in the art can fully practice. It should be understood that the various embodiments of the invention differ from each other, but are not mutually exclusive. For example, the specific shape, structure and characteristics of an embodiment described herein can also be implemented by other embodiments without departing from the spirit and scope of the present invention. In addition, it should be understood that the positions and arrangements of individual constituent elements in each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Therefore, the following detailed description is not intended to be limiting, and it is accurately stated that the protection scope of the present in...
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