A Diamond Wire Cutting Machine with Completely Planar Wiring

A diamond wire, flat technology, applied in the direction of stone processing tools, stone processing equipment, fine working devices, etc., can solve the problems of manual adjustment inconsistency, limited processing accuracy of parts, high material cost and labor cost, and achieve material Cost and labor replacement time cost reduction, simple processing and assembly, the effect of reducing cutting costs

Active Publication Date: 2015-08-19
曹爱苗
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the diamond wire is determined to be placed on a certain groove on the cutting guide wheel, there is only one position of the direction guide wheel that fully meets this requirement; therefore, there can be multiple grooves on the cutting guide wheel, and the direction guide wheel There can only be one groove on the wheel, and after changing the diamond wire to other grooves on the cutting guide wheel, the position of the guide wheel should also be adjusted; similarly, the groove on the tensioning wheel can only have 1 piece; since there can only be one groove on the guide pulley and the tension pulley, the replacement frequency of the guide pulley and the tension pulley is very high, resulting in high material and labor costs;
[0008] 2. As mentioned in the first point, when the diamond wire is determined to be placed in a certain groove on the cutting guide wheel, there is only one ideal position for the direction guide wheel. Due to the limited machining accuracy of parts and the inconsistency of manual adjustment, the diamond wire After tightening, it will not be completely in an ideal state, and will be pushed by both sides of the groove of the guide wheel; it will not only accelerate the wear of the groove, but the wear of the groove will also cause the instability of the diamond wire and affect the life of the diamond wire. increase costs;
[0009] 3. The cutting machine is bulky and the diamond wire has to pass between multiple guide wheels and cutting guide wheels, causing troublesome wiring;
[0010] 4. When the diamond wire is pulled out from the wire storage drum and finally connected to another wire storage drum through the running guide pulley, tensioning pulley, cutting guide pulley, etc., the diamond wire will rotate around its own central axis at a certain angle (like a twist shape but not so large), that is, the diamond wire is twisted, so that the diamond wire itself is subjected to a torsional force, which has a great adverse effect on the life of the diamond wire, and will make the diamond wire in the process of continuous reciprocating motion In addition, during the wiring process of the existing diamond wire cutting machine, the diamond wire has to change its direction many times, and the diamond wire between each two wheels is microscopically twisted. After changing the direction many times, the twist The cumulative amplitude is relatively large, which seriously affects the life of the diamond wire;
[0011] 5. The equipment is large in size and complex in structure, resulting in high equipment prices, often hundreds of thousands or even millions, and needs to be improved

Method used

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  • A Diamond Wire Cutting Machine with Completely Planar Wiring
  • A Diamond Wire Cutting Machine with Completely Planar Wiring
  • A Diamond Wire Cutting Machine with Completely Planar Wiring

Examples

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Embodiment Construction

[0039] The present invention will be further described below in conjunction with the accompanying drawings, but the present invention is not limited to the following examples.

[0040] Such as Figure 1-Figure 5 As shown, a diamond wire cutting machine with completely planar wiring according to the present invention includes a bed 1 and a wire storage mechanism, a wire transport mechanism, and a lifting platform 14 installed on the bed.

[0041] The lifting platform is driven by a ball screw pair 20. The lifting platform is equipped with several clamps 2 and at least one cutting buffer wheel 19 (buffering the diamond wire at the end of cutting). This part of the structure is similar to the prior art. When After starting the motor of the ball screw pair, let the screw rotate, and the lifting platform will rise or fall at a certain speed with the fixture and the workpiece on it.

[0042] The wire storage mechanism includes two wire storage drums installed in parallel on the sli...

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PUM

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Abstract

The invention relates to a diamond wire electrical discharge machine capable of completely flat wiring, and aims to provided the diamond wire electrical discharge machine having the advantages that a diamond wire is long in service life, wheels are free of abrasion, wiring is simple, structure is simple, size is small and cost is low on the basis of guaranteeing the normal cutting function. The technical scheme is that the diamond wire electrical discharge machine capable of completely flat wiring comprises a machine body, a wire storing mechanism, a wire conveying mechanism and a lifting platform, and the wire storing mechanism, the wire conveying mechanism and the lifting platform are all disposed on the machine body. The diamond wire electrical discharge machine is characterized in that the wire conveying mechanism comprises a group of forward wheels, a group of tensioning wheels and a group of cutting wheels, each of the forward wheel, the tensioning wheel and the cutting wheel is provided with at least two grooves arraying along the axial direction of the same, the grooves with the same serial number in all the forward wheels, the tensioning wheels and the cutting wheels form one group, namely a wire conveying channel of the diamond wire, and groove bottoms of all the grooves of the same group locate in the same plane.

Description

technical field [0001] The invention relates to the technical field of wire cutting, in particular to a diamond wire cutting machine. Background technique [0002] In industrial production, it is often necessary to cut materials with high hardness and high brittleness such as crystalline silicon, ceramics, and sapphire. The cost of using conventional methods such as laser cutting, plasma cutting, water cutting, grinding wheel cutting, and saw blade cutting is often high. Or it is not suitable for cutting at all, while wire cutting is a very suitable cutting process for hard and brittle materials. Silicon, diamond) constantly rub against hard and brittle materials to achieve the purpose of cutting. The movement state of the cutting blade relative to the wire is divided into two types: ①The cutting blade is separated from the wire, and the cutting blade is sprayed on the high-speed moving wire to be driven by it; ②The cutting blade is directly embedded on the wire, As the wi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B28D1/22
Inventor 曹爱苗
Owner 曹爱苗
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