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Hot pressing method of microfluidic chip

A technology of microfluidic chip and hot pressing method, which is applied in the field of microfluidic chip processing, and can solve problems such as complicated operation, time-consuming and laborious, and positional deviation

Inactive Publication Date: 2013-11-20
苏州扬清芯片科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, the base material of the chip is very easy to shift in position on the hot-pressing base plate, which will seriously affect the hot-pressing result
To solve this problem, people often use double-sided tape or glue to fix the edge of the multi-layer chip first to achieve chip immobilization, but this method is often slightly complicated to operate, and it is easy to cause edge damage due to excessive glue, so it needs Careful operation, time-consuming and labor-intensive

Method used

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  • Hot pressing method of microfluidic chip
  • Hot pressing method of microfluidic chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Embodiment 1 A chip thermocompression bonding method based on edge fixation

[0017] Such as figure 1 As shown, a heat-pressing chip fixing structure based on edge fixing includes a stainless steel bottom plate, a double-layer microfluidic chip, a magnetic block for fixing the edge of the chip, a heat-pressing upper plate, and a heat-pressing lower plate. The hot pressing process is as follows: 1) After aligning the two layers of PMMA chip substrates, place them on a polished stainless steel plate; 2) Use four rectangular NdFeB small magnetic blocks to fix the edges of the PMMA chips; 3) Install the stainless steel bottom plate with the microfluidic chip fixed between the two hot-pressing plates of the hot-pressing equipment, apply a temperature of 90-100°C and a pressure of 0.1-10MPa, and complete the hot-pressing.

Embodiment 2

[0018] Embodiment 2 A chip thermocompression bonding method based on positioning hole fixation

[0019] Such as figure 2 As shown, a chip fixation structure based on positioning holes by thermal compression includes a stainless steel bottom plate, a double-layer microfluidic chip, a magnetic block for fixing chip positioning holes, a thermally pressed upper plate, and a thermally pressed lower plate. The hot pressing process is as follows: 1) After aligning the two layers of PMMA chip substrates, place them on a polished stainless steel plate; 2) Use two small cylindrical NdFeB magnetic blocks to penetrate the positioning through holes of the PMMA chips , fixed; 3) Add a polished stainless steel plate on the surface of the microfluidic chip, and then install the stainless steel bottom plate with the microfluidic chip fixed in the middle of the two hot pressing plates of the hot pressing equipment, apply a temperature of 90 to 100 ° C and After the pressure of 0.1 ~ 10MPa, th...

Embodiment 3

[0020] Embodiment 3 A chip thermocompression molding method based on positioning hole fixation

[0021] with figure 2 The structures shown are similar. A chip fixation structure based on positioning holes includes a stainless steel bottom plate, a PMMA substrate, a magnetic block for fixing the chip positioning holes, a thermal pressing upper plate, and a thermal pressing lower plate. The hot pressing process is as follows: 1) After aligning a PMMA substrate, place it on a polished stainless steel plate; 2) Use two small cylindrical NdFeB magnetic blocks to penetrate and fix the positioning through hole of the PMMA chip ; 3) Add a metal nickel mold on the surface of the microfluidic chip, install the stainless steel bottom plate with the microfluidic chip fixed in the middle of the two hot-pressing plates of the hot-pressing equipment, apply a temperature of 90-150°C and a pressure of 0.1-10MPa After that, heat-press replication is completed.

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PUM

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Abstract

The invention provides a simple and fast hot pressing method used for a microfluidic chip. The method is characterized in that the hot pressing method comprises the characteristic steps that: (1) a thermoplastic microfluidic chip requiring hot-pressing bonding or hot-pressing molding is aligned, and is placed on a surface-polished stainless steel plate; (2) the microfluidic chip is fixed on a steel hot pressing pedestal with one or a plurality of magnetic materials with special shapes; and (3) the stainless steel pedestal with the fixed microfluidic chip is arranged between two hot pressing plates of a hot pressing device; and certain temperature and pressure are applied, such that hot pressing is completed. With the hot pressing method provided by the invention, chip fixing of the microfluidic chip in hot pressing can be simply realized with high efficiency.

Description

technical field [0001] The invention relates to the field of microfluidic chip processing, in particular to a hot pressing method for a microfluidic chip. Background technique [0002] Microfluidic chip (microfluidic chip), also known as lab-on-a-chip, has been widely used in chemistry, biology, medicine and other fields due to its characteristics of low sample consumption, fast analysis speed, and high-throughput detection. Among the various materials of microfluidic chips, thermoplastic materials such as polymethyl methacrylate (PMMA), polycarbonate (PC), etc., have become the most suitable materials for microfluidic chips due to their significant advantages of low material cost and low processing cost. A universally used material, especially suitable for batch processing of disposable microfluidic chips. [0003] At present, thermoplastic microfluidic chips are mainly prepared based on thermocompression molding or thermocompression bonding. However, in the hot-pressing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C51/14B29C51/26
Inventor 叶嘉明
Owner 苏州扬清芯片科技有限公司