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Preparation method for binary du maisy

A technology of iron-nickel alloy and core layer, applied in the direction of electrical components, cable/conductor manufacturing, circuits, etc., can solve the problems of easy blackening, difficult storage, and affecting glass sealing performance, etc., to achieve low product cost and high production efficiency Effect

Inactive Publication Date: 2013-11-20
丹阳利华电子有限公司
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Problems solved by technology

Because the surface of this product is a mixture of cuprous oxide and borate, it is easy to absorb the lake, easy to blacken, and difficult to store. At the same time, the thickness of the oxide layer is not easy to control in the production process. Too thick or too thin will affect its relationship with glass. Sealing performance

Method used

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Embodiment Construction

[0015] Binary Dumet wire is composed of a core layer of iron-nickel alloy and a cladding layer of metal oxygen-free copper (purity 99.95%~99.99%), which has the material properties of the two metals; the iron-nickel alloy has ultra-low expansion Among them, the control of carbon and manganese components is very important. Cold deformation can reduce the thermal expansion coefficient, and heat treatment in a specific temperature range can stabilize the thermal expansion coefficient. Iron-nickel alloys have corrosion resistance in dry air at room temperature.

[0016] Chemical composition of iron-nickel alloy:

[0017] name Nickel Ni Chromium Cr Iron Fe Carbon C Manganese Mn Silicon Si Cobalt Co Phosphorus P Sulfur S minimum value 36 0.30 maximum value 38 0.2 margin 0.03 0.60 0.2 0.5 0.02 0.01

[0018] The iron-nickel alloy wire rod is obtained by using the "vacuum induction melting / gas protection rapid di...

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PUM

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Abstract

The invention provides a preparation method for binary du maisy, which comprises the following steps: 1) preparing iron nickel alloy core layer; 2) taking metal oxygen free copper strip with 99.95 to 99.99 percent of purity; 3) composite molding. According to the binary du maisy prepared by the invention, copper containg is between 23 to 30 percent, the copper layer thickness ratio of the wire is smaller than 2.5 : 1, the specification is Phi 0.15 to 1.00 mm, the copper aluminum interface of the binary du maisy finished product achieves metallurgical bonding, the heat sealing experiment and method of the product surpasses relevant regulation of government standard (GB / 1248-89), and is high in manufacturing efficiency, low in product cost, and suitable for large-scale, normalized industrial manufacturing.

Description

technical field [0001] The invention relates to a new iron-nickel alloy material and a new continuous preparation process for composite molding of an isothermal state copper-coated iron-nickel alloy core material. Background technique [0002] Dumet wire is mainly used in electric vacuum devices, semiconductor devices and light bulb equipment, as well as the leads of internal and external conductance in imaging devices. The production method of the existing Dumet wire generally adopts the iron-nickel alloy rod with a certain expansion coefficient, which is double-metallic through copper cladding, and after being drawn, the surface is coated with borate products to obtain a surface color of orange. Red to deep red finish. Because the surface of this product is a mixture of cuprous oxide and borate, it is easy to absorb the lake, easy to blacken, and difficult to store. At the same time, the thickness of the oxide layer is not easy to control in the production process. Too th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/00
Inventor 汪亚英朱建华
Owner 丹阳利华电子有限公司
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