Anti-fake bill allowing codes to be changeable

Abstract

An anti-fake bill allowing codes to be changeable comprises an upper bill paper layer 1 and a lower bill paper layer 2, wherein a chip groove 4 and an annular frame groove 5 are formed in the upper portion of the lower bill paper layer 2, a chip 3 is arranged in the chip groove 4, a metal frame 6 is arranged in the frame groove 5, and the space between the frame groove 5 and the metal frame 6 is filled with a glue strip 7. The glue strip 7 is composed of, part by weight, 60-70 parts of methacrylic acid, 5-20 parts of acrylic acid, 20-30 parts of diethylene glycol, 3-6 parts of benzoyl, 0.5-2 parts of methyl toluidine, 0.1-0.3 part of benzoquinone, 2-4 parts of xylopropamine, 1-4 parts of dicumyl peroxide, 0.1-0.5 part of saccharin, 3-6 parts of triethylamine, 0.1-0.3 part of white carbon black, 1-4 parts of ethyl acetate, 0.5-3 parts of propylgallate, 0.3-0.9 part of p-benzoquinone dioxime, 1-3 parts of polysulfone resin and 0.2-0.6 part of 8-hydroxyquinoline. The metal frame serves as a support in the bill, the chip is located in the space defined by the metal frame in an enclosed mode, external force on the bill is resisted, the bill is prevented from being bent to be deformed or damaged, and completeness of the chip is guaranteed.

Description

technical field [0001] The invention relates to a ticket, specifically a variable code anti-counterfeit ticket. Background technique [0002] The password is an important security and anti-counterfeiting means of the bill, and the password is generally changed according to the needs of the bearer. In order to change the password easily, a chip is placed in the ticket, and the content of the chip is read and written by scanning to change the password. The existing bills are easy to be bent and damaged during the carrying process, and the chip is thus destroyed, the anti-counterfeiting effect of the bill disappears, and even cannot be used; the chip is placed in the bill, and the surrounding area of ​​the chip is bonded with an adhesive layer, and the existing adhesive layer Using thermal bonding, high temperature is likely to cause certain damage to the chip and affect the service life of the chip; gaps are prone to appear in the adhesive layer, allowing moisture in the air ...

AI Technical Summary

Problems solved by technology

The existing bills are easy to be bent and damaged during the carrying process, and the chip is thus destroyed, the anti-counterfeiting effect of the bill disappears, and even cannot be used; the chip is placed in the bill, and the surrounding area of ​​the chip is bonded with an adhesive layer, and the existing adhesive layer Using thermal bonding, high temperature is easy to cause certain damage to the chip and affect the service life of the chip; gaps are prone to appear in the adhesive layer, allowing moisture in the air to enter the chip, corroding the chip, and reducing the service life of the chip

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