Hybrid integrated circuit device and packaging method
A hybrid integrated circuit and packaging method technology, which is applied in the direction of circuits, measuring devices, microstructure devices, etc., to achieve the effects of reducing packaging volume and thickness, reliable lead connection, and novel structure
Inactive Publication Date: 2013-12-11
TIANSHUI HUATIAN MICROELECTRONICS
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Problems solved by technology
[0006] The purpose of the present invention is to provide a hybrid integrated circuit device to solve the technical problem of miniaturization and light weight of hybrid integrated circuits
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[0034] The following embodiments can further illustrate the present invention, but do not limit the present invention in any way.
[0035] Such as Figure 1-3As shown, a hybrid integrated circuit device includes a Kovar 4J29 housing 9 with more than 90% of the material used, and an insulating substrate 2 is provided on the bottom 3 of the housing, and a conductive pattern 6 is printed on the insulating substrate 2. On the conductive pattern 6 The circuit elements are fixed, and the inner and outer sides of the bottom of the housing 9 are respectively provided with an upper lead 13 and a lower lead 1 connected to the conductive pattern 6, the conductive pattern 6 is welded to the upper lead 13, and the conductive pattern 6 and the lower lead 1 are bonded. The upper lead 13 does not protrude from the outer bottom 4 of the housing. The distance L3 from the bottom end of the upper lead to the outer bottom of the housing is 0.8-1.2mm. The bottom end of the upper lead 13 is covered ...
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Abstract
The invention discloses a hybrid integrated circuit device and a packaging method, in order to solve the technical problems of miniaturization and light weight of a hybrid integrated circuit. The hybrid integrated circuit device comprises a housing, wherein an insulating substrate is arranged on the bottom in the housing; conductive patterns are printed on the insulating substrate; circuit elements are fixed on the conductive pattern; upper lead wires and lower lead wires which are connected with the conductive pattern are arranged on the inner side and the outer side of the bottom of the housing respectively; a cover plate with a center hole is arranged in the housing; a mounting component is arranged on the cover plate; the mounting component is connected with the upper lead wires; and the housing is connected with a pipe cap. Compared with the prior art, the hybrid integrated circuit device and the packaging method have the following advantages that the lead wires are arranged on the upper side and the lower side of the bottom of the housing, and the mounting component is mounted in the housing, so that the hybrid integrated circuit device can be electrically connected with other modules of a system and the mounting component, the elements can be mounted at high density, the packaging volume and thickness of a packaging structure are reduced, and miniaturization of the hybrid integrated circuit elements is facilitated.
Description
technical field [0001] The invention relates to a hybrid integrated circuit device and a packaging method. Background technique [0002] In recent years, with the continuous development of electronic products in the direction of lightness, thinness, shortness and smallness, integrated circuits are also developing in the direction of high-density miniaturization. In addition, due to more and more functions of products, most products use Integrate design in a modular way. However, integrating multiple modules with different functions in the product can greatly increase the function of the product, but under the current demand for miniaturization and exquisite appearance of the product, how to design a product that is both small in size and multi-functional? High-quality products are the goals of modern electronic product manufacturers' research. [0003] In addition, in order to make electronic products rapidly develop towards miniaturization. In terms of semiconductor manu...
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IPC IPC(8): B81C1/00B81B7/00H01L25/04
Inventor 张兴安王慧梅
Owner TIANSHUI HUATIAN MICROELECTRONICS