Laminated sheet type bypass wave absorbing device and manufacturing method thereof

A manufacturing method and wave absorber technology, applied in impedance networks, electrical components, multi-terminal pair networks, etc., can solve the problems of difficulty in making larger, weakening effect, and small inductance, so as to suppress electromagnetic interference and improve anti-interference ability. Effect

Active Publication Date: 2013-12-11
SHENZHEN ZHENHUA FU ELECTRONICS
View PDF5 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional digital IC power supply noise suppression and bypass decoupling mostly use ceramic capacitors to decouple noise suppression. Its insertion loss characteristic curve is relatively flat, and the weakening effect is poor when the noise is too large. Series inductors or ferrite beads to compensate
Although traditional

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laminated sheet type bypass wave absorbing device and manufacturing method thereof
  • Laminated sheet type bypass wave absorbing device and manufacturing method thereof
  • Laminated sheet type bypass wave absorbing device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0039] Such as figure 1 Shown is a cross-sectional view of an embodiment of the laminated chip bypass absorber. The laminated sheet type bypass absorber includes a first cover 100, an intermediate layer 200 and a second cover 300. The first cover 100 is a dielectric ceramic material diaphragm. The intermediate layer 200 includes a chip capacitor unit 210 and a chip inductor functional device unit 220. The chip capacitor unit 210 and the chip inductor unit 220 are stacked in parallel. The layers are integrated in a laminated chip monomer. The chip capacitor monomer 210 includes a dielectric ceramic material diaphragm 212 and an internal electrode 214 printed on it. Accordingly, the chip inductor functional device monomer 220 includes a ferrite material diaphragm 222 and an internal electrode 224 printed on it. , The second cover 300 is a ferrite material diaphragm.

[0040] It can be understood that the positions of the first cover 100 and the second cover 300 can be interchange...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a laminated sheet type bypass wave absorbing device which comprises a first cover body, a middle layer and a second cover body, wherein the first cover body, the middle layer and the second cover body are sequentially laminated. The middle layer comprises a sheet type capacitor unit and a sheet type inductance function device unit which are laminated in parallel. The invention further discloses a manufacturing method of the laminated sheet type bypass wave absorbing device. The laminated sheet type bypass wave absorbing device and the manufacturing method can meet the wave filtering requirements in different frequency bands, and the slope of an insertion loss characteristic curve is steeper. Compared with a wave absorbing device with a single capacitor or a single inductor, the laminated sheet type bypass wave absorbing device can more effectively absorb noise waves in an electronic circuit and restrain electromagnetic interference of the electronic circuit, and the interference resistant capacity of an electronic device and the reliability of a system are improved.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a laminated chip bypass absorber and a manufacturing method thereof. Background technique [0002] With the continuous advancement of science and technology and the gradual improvement of human living standards, household electrical appliances, mobile and personal portable electronic devices are increasing day by day. In the process of using electronic equipment, electronic equipment will interact and interfere with each other, causing damage to integrated circuits and semiconductor devices. The key to solving this problem is the noise suppression and bypass decoupling of digital IC power supplies. [0003] Traditional digital IC power supply noise suppression and bypass decoupling mostly use ceramic capacitors to decouple noise suppression. Its insertion loss characteristic curve is relatively flat, and the weakening effect is poor when the noise is too large. Con...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H03H7/01
Inventor 樊应县徐鹏飞李建辉刘季超李耀坤庞岩罗洪梁林亚梅税莎王智会杨琼
Owner SHENZHEN ZHENHUA FU ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap