Laminated sheet type bypass wave absorbing device and manufacturing method thereof

Abstract

The invention discloses a laminated sheet type bypass wave absorbing device which comprises a first cover body, a middle layer and a second cover body, wherein the first cover body, the middle layer and the second cover body are sequentially laminated. The middle layer comprises a sheet type capacitor unit and a sheet type inductance function device unit which are laminated in parallel. The invention further discloses a manufacturing method of the laminated sheet type bypass wave absorbing device. The laminated sheet type bypass wave absorbing device and the manufacturing method can meet the wave filtering requirements in different frequency bands, and the slope of an insertion loss characteristic curve is steeper. Compared with a wave absorbing device with a single capacitor or a single inductor, the laminated sheet type bypass wave absorbing device can more effectively absorb noise waves in an electronic circuit and restrain electromagnetic interference of the electronic circuit, and the interference resistant capacity of an electronic device and the reliability of a system are improved.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a laminated chip bypass absorber and a manufacturing method thereof. Background technique [0002] With the continuous advancement of science and technology and the gradual improvement of human living standards, household electrical appliances, mobile and personal portable electronic devices are increasing day by day. In the process of using electronic equipment, electronic equipment will interact and interfere with each other, causing damage to integrated circuits and semiconductor devices. The key to solving this problem is the noise suppression and bypass decoupling of digital IC power supplies. [0003] Traditional digital IC power supply noise suppression and bypass decoupling mostly use ceramic capacitors to decouple noise suppression. Its insertion loss characteristic curve is relatively flat, and the weakening effect is poor when the noise is too large. Con...

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Problems solved by technology

[0003] Traditional digital IC power supply noise suppression and bypass decoupling mostly use ceramic capacitors to decouple noise suppression. Its insertion loss characteristic curve is relatively flat, and the weakening effect is poor when the noise is too large. Series inductors or ferrite beads to compensate

Although traditional multilayer chip EMI suppression filters are mostly LC combinations, its product capacity can be serialized, but its inductance is relatively small, and it is difficult to expand

Its insertion loss characteristic curve is steeper than that of a single capacitor, but the attenuation effect is not very ideal when the noise is too large

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