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Copper titanate nanoneedle and preparation method thereof

A nano-needle, copper titanate technology, applied in nanotechnology, nanotechnology, chemical instruments and methods, etc., can solve the problems of copper titanate nano-needle reporting and other problems, and achieve the effect of batch preparation, low cost and low preparation temperature

Inactive Publication Date: 2013-12-25
ANHUI UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, so far, there have been no reports on copper titanate nanoneedles

Method used

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  • Copper titanate nanoneedle and preparation method thereof
  • Copper titanate nanoneedle and preparation method thereof
  • Copper titanate nanoneedle and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Mix tetrabutyl titanate, copper acetate, SDS and water evenly, place in a reaction vessel and seal it, the molar ratio of tetrabutyl titanate to copper acetate is 1:1, tetrabutyl titanate, copper acetate account for water 10% of the weight, the amount of SDS accounts for 5% of the water weight, and the total amount of tetrabutyl titanate, copper acetate, SDS and water accounts for 60% of the filling degree of the airtight container. Then, the temperature was kept at 200° C. for 24 hours, and finally a flocculent gray product of copper titanate nanoneedles with a length of about 6 μm and a diameter of about 50 nm at the tip of the nanoneedles was obtained.

Embodiment 2

[0026] Mix tetrabutyl titanate, copper acetate, SDS and water evenly, place in a reaction vessel and seal it, the molar ratio of tetrabutyl titanate to copper acetate is 1:1, tetrabutyl titanate, copper acetate account for water 8% by weight, the amount of SDS accounts for 5% by weight of water, and the total amount of tetrabutyl titanate, copper acetate, SDS and water accounts for 50% of the filling degree of the airtight container. Then, it was kept at a temperature of 180°C for 24 hours, and finally a flocculent gray product of copper titanate nanoneedles with a length of about 6 μm and a diameter of the nanoneedle tip of about 50 nm was obtained.

Embodiment 3

[0028] Mix tetrabutyl titanate, copper acetate, SDS and water evenly, place in a reaction vessel and seal it, the molar ratio of tetrabutyl titanate to copper acetate is 1:1, tetrabutyl titanate, copper acetate account for water 7% by weight, the amount of SDS accounts for 4% by weight of water, and the total amount of tetrabutyl titanate, copper acetate, SDS and water accounts for 60% of the filling degree of the airtight container. Then it was kept at a temperature of 180° C. for 48 hours, and finally a flocculent gray product of copper titanate nanoneedles with a length of about 6 μm and a diameter of the nanoneedle tip of about 50 nm was obtained.

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Abstract

The invention discloses a copper titanate nanoneedle and a preparation method of the copper titanate nanoneedle, and belongs to the technical field of nanometer material preparation. The length of the copper titanate nanoneedle is 1-6 microns, and the diameter of the tip of the copper titanate nanoneedle is 10-50 nanometers. The copper titanate nanoneedle is prepared in the mode that tetrabutyl titanate and copper acetate which are used raw materials, water which is used as a solvent and sodium dodecyl sulfate (SDS) which is used as a structure-directing agent are heated at a low temperature in a closed container for a period of time. According to the novel copper titanate nanoneedle and the method of preparing a large number of the copper titanate nanoneedles in a low-temperature chemical process, the adopted materials and the preparation process do not cause pollution to the environment, and a large number of the copper titanate nanoneedles can be prepared.

Description

technical field [0001] The invention belongs to the technical field of nanomaterial preparation, and in particular relates to a copper titanate nanoneedle and a preparation method thereof. Background technique [0002] Copper titanate is an important semiconductor material, which has the characteristics of high dielectric constant, low dielectric loss, good dielectric temperature characteristics and anti-aging performance, and has good application prospects in semiconductor devices and sensors. As an additive of semiconductor ceramics, copper titanate can improve the dielectric properties of semiconductor ceramics. As a photocatalyst, it can degrade organic pollutants. It has good application potential in the fields of industrial wastewater treatment, environmentally friendly self-cleaning coatings and glass. Copper titanate powder with irregular shape can be prepared by high temperature solid phase method. [0003] The shape and size of semiconductor materials have an impo...

Claims

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Application Information

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IPC IPC(8): C01G23/00B82Y40/00B82Y30/00
Inventor 裴立宅
Owner ANHUI UNIVERSITY OF TECHNOLOGY
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