The invention relates to the field of
copper plating solutions, and provides a low-stress chemical
copper plating solution for a glass substrate and a preparation method of the low-stress chemical
copper plating solution. The invention discloses a copper
ion carboxyl chelate, which is composed of copper
ion carboxyl chelate, 2, 2 '-
bipyridine,
polyethylene glycol-8000, lauryl
sodium sulfate, a
sodium carbonate buffer agent, deionized water and a pretreatment
solvent, and the copper
ion carboxyl chelate is prepared by chelating a polyacrylate-
itaconic acid copolymer with
copper chloride and then carrying out stepwise cross-linking with
epichlorohydrin and N, N'-
methylene bisacrylamide. The copper-bis-
salicylaldehyde ethylenediamine complex is obtained by reacting bis-
salicylaldehyde ethylenediamine with copper acetate, crystallizing and purifying. The preparation method comprises the steps of
solvent premixing, chelating activation, staged additive integration, pH dynamic regulation and control and plating solution purification, through
nitrogen protection, high-shear stirring and accurate
pH regulation, the problems that a traditional chemical
copper plating layer is high in stress and poor in
conductivity are solved, and the method is suitable for high-precision glass
substrate surface metallization.