Cooling device of space optical remote sensor

Abstract

The invention discloses a cooling device of a space optical remote sensor. The cooling device of the space optical remote sensor comprises a radiator (1), a heat reservoir (2), at least one L-shaped heat pipe (3) and two heat insulation plates (4), wherein thermal control coatings which are high in infrared emittance and low in solar absorptivity are arranged on the outer surfaces, facing a copious cooling space, of the radiator (1) and the heat reservoir (2), other outer surfaces of the radiator (1) and the heat reservoir (2) are respectively coated with multiple layers of heat insulation assemblies, the heat reservoir (2) and the radiator (1) are machined integrally to form a part with an L-shaped cross section, both the heat reservoir (2) and the radiator (1) are filled with phase-change materials, the bottom of the heat reservoir (2) faces the earth and prevents heat flow coming from the earth from reaching the radiator (1) together with the heat insulation plates (4), and the at least one L-shaped heat pipe (3) is installed in the radiator (1) and in the heat reservoir (2). The cooling device of the space optical remote sensor has the advantages that resources on a satellite can be saved, heat disturbance from the earth can be eliminated, and temperature of electronic equipment which emits heat intermittently and is arranged inside the space optical remote sensor is controlled.

Description

technical field [0001] The invention relates to a cooling device for a space optical remote sensor. Background technique [0002] Electronic equipment is an important part of the space optical remote sensor. It generates a lot of heat when it works. Effective thermal design is required to discharge the heat from the remote sensor and control the temperature of the electronic equipment within a reasonable range to reduce the temperature caused by intermittent work. temperature fluctuations. The existing design method is as follows: a heat dissipation surface is provided outside the remote sensor, the electronic equipment and the heat dissipation surface are used to realize thermal conduction with heat conduction elements, and the heat is discharged to the cold space by the heat dissipation surface. At the same time, in order to prevent the temperature of the electronic equipment from being too low when it is not working, it is necessary to use a heating compensation method t...

AI Technical Summary

Problems solved by technology

Its main disadvantages are: firstly, the large temperature fluctuations of the electronic equipment cause large temperature fluctuations in the optical system of the remote sensor, which cannot meet the normal imaging requirements of the remote sensor; secondly, an additional electric heating circuit for heating compensation of the electronic equipment is required , occupying limited on-board resources; third, the heat dissipation surface is designed as a flat plate, and the flight in orbit will be disturbed by the earth's heat flow, which offsets part of the heat dissipation capacity

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