Test system and method for cooling performance of microscale liquid cooler

Abstract

The invention discloses a test system and method for the cooling performance of a microscale liquid cooler. The test system for the cooling performance of the microscale liquid cooler comprises the microscale liquid cooler, a heating device, a temperature measurement system, a cooling liquid circulator, a metering pump and a diverter. According to the test system, on one hand, high reliability, high accuracy and high precision of a micro-fluid division control technology are utilized, and the temperature, the flow and the pressure of the cooling liquid are accurately controlled step by step through the cooling liquid circulator, the metering pump and the diverter, so as to achieve accurate control of low-flow or extra-low flow cooling liquid; on the other hand, a surface temperature field of the heating device is monitored in real time by adopting an advanced infrared thermal imaging technology; visual observation of a working temperature field of a microscale device is achieved. By adopting the test system, the accuracy, the precision and the reliability of measurement of the cooling performance of the microscale liquid cooler are greatly improved; the test system is especially suitable for test of the cooling performances of the microscale liquid coolers for aerospace, information communication, transportation and medical treatment, automatic control, consumer electronics and the like.

Description

technical field [0001] The invention relates to heat dissipation performance testing technology, in particular to a microscale liquid cooler heat dissipation performance testing system and a testing method thereof. Background technique [0002] With the rapid development of microelectronics technology, miniaturization, high integration, multi-function, and high power have gradually become the trend and trend of electronic products. The size of microelectronic devices is getting smaller and smaller, from the micron level to the nanometer level, and the integration level is increasing at a rate of 40% to 50% per year. There are hundreds of thousands of components on each chip, and high-performance chips And the heat flux density of electronic devices has exceeded 100W / cm 2 , thermally induced failure has gradually become a bottleneck restricting the development of microelectronics technology. To take away the high heat generated on micro-scale devices, natural cooling techno...

AI Technical Summary

Problems solved by technology

The micro-scale liquid cooler can avoid the leakage and thermal hysteresis caused by direct liquid cooling, indirect liquid cooling, liquid jet cooling, spray cooling, drip cooling and other liquid cooling technologies in practical applications. Problems such as excessive stress, chip thermoelectric mismatch and inconvenient system maintenance provide a good solution to the problem of thermally induced failure of microelectronic devices

[0004] However, the coolant (microfluid) flow rate in the micro-scale radi...

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