Fully automatic megasonic semiconductor wafer cleaning equipment

Abstract

The invention discloses a full-automation mega sound wave semiconductor wafer cleaning device. Mega sound waves generated by a mega sound wave generator are used for entering a mega sound wave cleaning mechanism arranged in a cavity. Clean ID water entering from a water inlet end can correspondingly contain ultrasonic wave energy and pollutants of a workpiece which is rotating on a cleaning plate are punched through and gasified. Meanwhile, water enters through a double fluid cleaning mechanism is used for being mixed with entering compressed air to generate atomization deionized water molecules. The atomized deionized water molecules can be fully fill into the whole cavity and small seams of the workpiece so as to achieve the effect of fully cleaning. Compared with the prior art, the manner of combining double fluids, high-frequency mega sound waves and ion wind is used for cleaning a high-precision semiconductor wafer, and meeting the requirement for the cleanliness of the high-precision semiconductor wafer. Meanwhile, after the high-precision semiconductor wafer is cleaned, the high-precision semiconductor wafer is rapidly dried in a centrifuge dripping mode, the working efficiency is effectively improved and the cleaning effect is ensured.

Description

Technical field: [0001] The invention belongs to the technical field of semiconductor cleaning, and in particular relates to a fully automatic megasonic semiconductor wafer cleaning device. Background technique: [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and become an IC with specific electrical functions. product. With the development of the size of integrated circuits on semiconductor wafers to the micron level, the cleaning requirements in the semiconductor wafer manufacturing process are getting higher and higher, especially if the semiconductor wafers are polluted by dust particles and metals during the manufacturing process, It is easy to cause damage to the function of the circuit in the chip, form a short circuit or an open circuit, etc., resulting in the failure of...

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Problems solved by technology

[0004] However, with the further understanding and development of aviation technology and space technology, more and more precise circuit boards, wafers and semiconductor components are required. The spray cleaning of general single wafer cleaning equipment can no longer achieve the cleanliness of high precision wafers. requirements, which requires the development of high-end precision cleaning equipment that can meet this requirement on the basis of the original

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