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Multilayer wideband bandpass filter

A band-pass filter and broadband technology, applied in the field of multi-layer broadband band-pass filters, can solve the problems of difficult design and processing technology, large volume, sensitive to changes in physical size, etc., and achieve high circuit space utilization and volume reduction. Small, easily controllable passband center frequency and bandwidth

Inactive Publication Date: 2016-02-17
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
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Problems solved by technology

There are many ways to realize a wideband bandpass filter, and the more common ways are: (1) Use a low-pass filter and a high-pass filter in series structure, through which a wideband bandpass filter can be obtained, but its circuit structure is complex , Large volume; (2) Multi-mode structure is adopted, but this structure is sensitive to changes in physical dimensions, and the design and processing technology are difficult

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  • Multilayer wideband bandpass filter
  • Multilayer wideband bandpass filter

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Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0020] Such as figure 1 As shown, the multilayer broadband bandpass filter in this embodiment includes a first metal formation layer 1, a first main line layer 2, a second main line layer 3, a second metal formation layer 4, a through The two input / output electrodes 5, 5' that are symmetrically distributed on the sides of the first metal formation layer 1, the first main circuit layer 2, the second main circuit layer 3 and the second metal formation layer 4 penetrate through and are located on the first metal formation layer 1. A ground wire 6 on the side of the first main circuit layer 2 , the se...

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Abstract

A multi-layer broadband bandpass filter applied in the field of communication disclosed by the present invention comprises a first metal formation layer, a first main circuit layer, a second main circuit layer, a second metal formation layer, an input / output electrode and a grounding layer arranged in sequence line, wherein the first main line layer includes a dielectric substrate and two input / output feeders and two coupling transmission lines symmetrically distributed on the upper surface of the dielectric substrate, and the second main line layer includes a dielectric substrate and a A T-shaped resonant structure composed of three transmission lines fixedly connected. The present invention forms a broadband bandpass filter through the interlayer coupling between the T-shaped resonant structure and the coupling transmission line and the input / output feeder, and due to the multipath effect of the interlayer signal propagation of the main line, four transmission channels can be generated near the passband of the filter. Zero point, the filter has high frequency selectivity and out-of-band rejection. At the same time, the multilayer broadband bandpass filter adopts a multilayer structure, which has high space utilization and small size.

Description

technical field [0001] The invention belongs to the technical field of microwave communication, and in particular relates to a multi-layer broadband band-pass filter with high frequency selection and high out-of-band suppression. Background technique [0002] With the rapid development of next-generation high-data-rate wireless communication systems, higher requirements are placed on high-performance, miniaturized broadband microwave bandpass filters. There are many ways to realize a wideband bandpass filter, and the more common ways are: (1) Use a low-pass filter and a high-pass filter in series structure, through which a wideband bandpass filter can be obtained, but its circuit structure is complex , Large size; (2) Multi-mode structure is adopted, but this structure is sensitive to changes in physical dimensions, and the design and processing technology are difficult. Contents of the invention [0003] The object of the present invention is to overcome the above-mentio...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/203
Inventor 尉旭波袁双林乐国韬廖家轩徐自强汪澎金龙田忠石玉
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA