Process for processing two-sided and multilayer circuit board
A processing technology and circuit board technology, which is applied in multi-layer circuit manufacturing, printed circuit, printed circuit manufacturing, etc., can solve the problems of health hazards for operators, complicated manufacturing process, and many transfer links, so as to reduce production costs and save Process flow and the effect of reducing the number of plate transfers
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[0051] detailed description
[0052] In order to demonstrate the effect of the present invention, the present invention will be further illustrated by specific examples below. However, it should be understood that these embodiments are only used for more detailed description, and should not be construed as limiting the present invention in any form.
[0053] A double-sided circuit board processing technology, the double-sided circuit board processing technology includes the following steps:
[0054] 1) Cutting, cutting the original sheet into a predetermined size substrate, the upper and lower sides of the substrate are covered with copper layers;
[0055] 2) Drill holes. Use a high-speed drill to drill the required vias on the substrate cut in step 1);
[0056] 3) Plating organic conductive film, and plating the wall of the via hole drilled in step 2) with organic conductive film;
[0057] 4) Thicken the copper, through the effect of the organic conductive film on the hole wall, the h...
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