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Magnetron sputtering coating device and coating method

A technology of magnetron sputtering coating and coating equipment, which is applied in sputtering coating, ion implantation coating, vacuum evaporation coating, etc., can solve the problem of limited vacuum chamber space of coating device, inability to handle large-scale and structural equipment, and inability to achieve Multi-batch, multi-directional coating and other issues, to achieve the effect of consistent thickness, simple operation and high efficiency

Active Publication Date: 2014-01-08
JIANGSU ZHONGNENG POLYSILICON TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the vacuum chamber space of this coating device is limited, and it cannot handle large-scale and complex-structured equipment, and cannot realize multi-batch and multi-directional coating

Method used

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  • Magnetron sputtering coating device and coating method
  • Magnetron sputtering coating device and coating method
  • Magnetron sputtering coating device and coating method

Examples

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Embodiment Construction

[0033] The CVD reactor inner wall coating device of the present invention will be described in detail below through specific embodiments in conjunction with the accompanying drawings, but these embodiments are only for the purpose of illustration and are not intended to limit the scope of the present invention.

[0034] Such as figure 1 As shown, the CVD reactor inner wall coating device according to the present invention includes a coating equipment main body 1, a frame platform 7, a baffle plate 4, a cooling facility 5 and a pump group 8, wherein the coating equipment main body 1 includes a sleeve 2 , the ion source 10 and the cathode target 3 are fixed on the sleeve 2, the frame platform 7 has multiple connections, and the coating equipment main body 1 is connected to the innermost connection of the frame platform 7. The mechanism to be plated outside the sleeve 2 is connected to the outermost connection of the frame platform 7, and a closed chamber is formed between the sl...

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Abstract

The invention discloses a magnetron sputtering coating device and a coating method. The device comprises a coating device main body, a frame platform, a baffle plate, a cooling device and a pump set; the coating device main body comprises a sleeve; at least one ion source and at least one cathode are fixed on the sleeve; the sleeve of the coating device main body forms an enclosed chamber with a mechanism to be coated at the outside of the sleeve; the inner wall of the external mechanism to be coated is coated with a set target material by a magnetron sputtering method. According to the invention, multi-batch and multi-direction coating is realized based on different requirements. The method meets requirements for uniformity and thickness of magnetron sputtering films, solves the problem of coating requirements of large-scale and complex-structure equipment, is simple in operation, high in efficiency, and good in film uniformity.

Description

technical field [0001] The invention relates to a coating device and a coating method, in particular to a device and a method for coating equipment to be coated by magnetron sputtering under vacuum conditions. Background technique [0002] Magnetron sputtering (magnetron-sputtering) is a "high-speed low-temperature sputtering technology" developed rapidly in the 1970s. Magnetron sputtering is the formation of an orthogonal electromagnetic field above the surface of the cathode target. When the secondary electrons generated by sputtering are accelerated into high-energy electrons in the cathode drop region, they do not fly directly to the anode, but oscillate back and forth in an approximately cycloidal motion under the action of an orthogonal electromagnetic field. High-energy electrons continuously collide with gas molecules and transfer energy to them, ionizing them and becoming low-energy electrons themselves. These low-energy electrons eventually drift along the magnet...

Claims

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Application Information

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IPC IPC(8): C23C14/35
Inventor 钟真武于伟华郄丽曼
Owner JIANGSU ZHONGNENG POLYSILICON TECH DEV
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