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Copper foil composite, copper foil used therefor, molded body, and manufacturing method thereof

A technology of composites and moldings, applied in the field of copper foil and copper foil composites, can solve problems such as poor electromagnetic wave shielding, and achieve the effect of improving bendability

Active Publication Date: 2015-11-25
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the other hand, when the shielded body is covered with copper braiding, etc., the shielded body is exposed in the mesh portion, so the electromagnetic wave shielding property is poor.

Method used

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  • Copper foil composite, copper foil used therefor, molded body, and manufacturing method thereof
  • Copper foil composite, copper foil used therefor, molded body, and manufacturing method thereof
  • Copper foil composite, copper foil used therefor, molded body, and manufacturing method thereof

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Embodiment

[0056] 1. Copper foil composite

[0057]

[0058] For ductile copper (JIS-H3100 (alloy number: C1100)), hot rolling ingots added with the additive elements shown in Table 1 to Table 3, or for oxygen-free copper (JIS-H3100 (alloy number: C1020)), hot rolling After rolling the ingot with the added elements shown in Table 4, remove oxides by cutting the surface, and then repeat cold rolling, annealing and pickling to make it thinner to a specific thickness. In the case of cold rolling with a thickness of 0.1mm or less , copper is heated to 100 to 110° C. and rolled to obtain a copper foil that ensures workability. The tension during rolling and the rolling conditions in the width direction of the rolled material were made the same so that the copper foil had a uniform structure in the width direction. In addition, in order to obtain a uniform temperature distribution in the width direction during rolling, temperature control is performed using a plurality of heaters, and the t...

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Abstract

The present invention provides a copper foil composite with improved bendability and a copper foil used therefor. The present invention is a copper foil composite in which a copper foil and a resin layer are laminated, and the copper foil contains a total of 30 to 500 mass ppm selected from Sn, Mn, Cr, Zn, Zr, Mg, Ni, Si, and Ag. At least one of the copper foils, the tensile strength of the copper foil is 100-180MPa, the aggregation degree of the (100) plane of the copper foil, that is, I200 / I0200, is 30 or more, and the average crystal grain size observed from the plate surface of the copper foil is 10~ 400μm.

Description

technical field [0001] The present invention relates to a copper foil composite which is preferable as an electromagnetic wave shielding material, a copper laminate for FPC, and a substrate requiring heat dissipation, and a copper foil used therefor. Background technique [0002] A copper foil composite in which copper foil and a resin film are laminated is used as an electromagnetic wave shielding material (for example, Patent Document 1). Copper foil has electromagnetic wave shielding properties, and a resin film is laminated in order to strengthen the copper foil. As a method of laminating a resin film on copper foil, there are a method of laminating a resin film on copper foil with an adhesive, a method of vapor-depositing copper on the surface of a resin film, and the like. Since it is necessary to make the thickness of copper foil several micrometers or more in order to ensure electromagnetic wave shielding property, the method of laminating a resin film on copper foi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08B32B15/20C22C9/00C22C9/02C22C9/04C22C9/05C22C9/06C22C9/10H05K1/03H05K1/09H05K9/00C22F1/00C22F1/08
CPCB32B7/12B32B15/01B32B15/08B32B15/20B32B27/281B32B27/32B32B2255/06B32B2307/208B32B2307/212B32B2307/546B32B2457/00B32B2457/20C22C9/00C22C9/02C22C9/04C22F1/08H05K1/09H05K2201/0355H05K2201/0358Y10T29/30Y10T428/12431Y10T428/31678H05K1/03H05K9/00B21D33/00H05K9/0084
Inventor 冠和树
Owner JX NIPPON MINING & METALS CORP