Infrared sensor manufacturing method of Zigbee

A technology of an infrared sensor and a manufacturing method, which is applied in the field of sensors, can solve the problems of large heat capacity of the device, cumbersome processes, rate limitation, etc., and achieves the effects of fast response speed, simple process and high reliability

Inactive Publication Date: 2014-01-15
柳州市宏亿科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the infrared sensors on the market are mostly made of ceramic body materials, the process is cumbersome and the cost is high
In addition, the thickness of the ceramic body material is tens of microns, the heat capacity of the device is large, and the corresponding rate increase is limited

Method used

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  • Infrared sensor manufacturing method of Zigbee
  • Infrared sensor manufacturing method of Zigbee

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] like figure 1 and 2 As shown, a Zigbee infrared sensor manufacturing method is carried out according to the following steps:

[0029] (1) Provide a substrate 10, which is an SOI substrate;

[0030] (2) A plurality of grooves 11 are finely processed in the substrate 10, filled with the first release sacrificial layer in the grooves 11, and covered with a diaphragm 9 on the surface of the substrate 10, and the diaphragm 9 is porous polyimide;

[0031] (3) Forming the lower electrode 5 on the diaphragm 9;

[0032] (4) performing a gas phase release process to remove the first release sacrificial layer;

[0033] (5) Forming a pyroelectric layer 8 on the diaphragm 9 and the lower electrode 5;

[0034] (6) Form an infrared structural absorption layer 3 on the upper surface of the substrate 12, and locally form a plurality of pixels 7 in the substrate 12. In the formation step of the infrared structural absorption layer 3, deposit a colloidal particle dispersion, thereby ...

Embodiment 2

[0042] like figure 1 and 2 As shown, a Zigbee infrared sensor manufacturing method is carried out according to the following steps:

[0043] (1) Provide a substrate 10, which is an SOI substrate;

[0044] (2) A plurality of grooves 11 are finely processed in the substrate 10, filled with the first release sacrificial layer in the grooves 11, and covered with a diaphragm 9 on the surface of the substrate 10, and the diaphragm 9 is porous polyimide;

[0045] (3) Forming the lower electrode 5 on the diaphragm 9;

[0046] (4) performing a gas phase release process to remove the first release sacrificial layer;

[0047] (5) Forming a pyroelectric layer 8 on the diaphragm 9 and the lower electrode 5;

[0048] (6) Form an infrared structural absorption layer 3 on the upper surface of the substrate 12, and locally form a plurality of pixels 7 in the substrate 12. In the formation step of the infrared structural absorption layer 3, deposit a colloidal particle dispersion, thereby ...

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PUM

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Abstract

The invention discloses an infrared sensor of Zigbee. An infrared sensor circuit, a signal collecting circuit, a Zigbee module, an antenna, a host and a power supply module are included. The infrared sensor circuit is connected with the signal collecting circuit which is connected with the Zigbee module. The Zigbee module is connected with the host through the antenna. The power supply module is respectively connected with the infrared sensor circuit, the signal collecting circuit and the Zigbee module. The infrared sensor has the advantages that whether someone invades can be detected, household wiring is lowered, and anti-jamming capability is strong.

Description

technical field [0001] The invention belongs to the field of sensors, in particular to a method for making a Zigbee infrared sensor. Background technique [0002] Wireless sensor network is one of the most widely used networks in recent years. With the development of Internet technology, the research on wireless sensor network will also have a great development. Zigbee technology is more mature among many wireless sensor network technologies. It has the characteristics of the lowest power consumption and cost, sufficient transmission speed and distance, large network capacity and good security features. [0003] The Zigbee infrared sensor designed by the applicant can be applied to control devices such as non-contact switching machines and alarms, and has broad application prospects in automatic control, electrical energy saving, security and other fields. At present, the infrared sensors on the market are mostly made of ceramic body materials, and the process is cumbersome...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18
CPCH01L21/77H10N19/00Y02P70/50
Inventor 王萌唐新来李健军
Owner 柳州市宏亿科技有限公司
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