Cutting blade

A grinding wheel, three-dimensional technology, applied in the direction of bonded grinding wheels, abrasives, metal processing equipment, etc., can solve the problems of reduced dimensional accuracy, inability to obtain cutting performance, etc., to improve wear resistance and cutting performance, and suppress the generation of burrs , Improve the effect of cutting performance

Inactive Publication Date: 2014-01-15
TOKYO SEIMITSU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In addition, in the above-mentioned grinding wheel sheet for cutting, since the shrinkage rate of the resin in a specific direction becomes large after molding, the dimensional accuracy of the product decreases, and the desired cutting performance cannot be obtained.

Method used

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Examples

Experimental program
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Effect test

Embodiment

[0065] Next, the effects of the present invention will be described with reference to more specific examples.

no. 1 Embodiment

[0067]In this example, eight types of grinding wheel pieces for cutting were prepared with powdered WC filler 5 having a constant content (25%) and varying the addition ratio of filler 4 as a zinc oxide crystal structure, in the resin bond phase 2 A grinding wheel sheet for cutting in which the silane coupling agent is not mixed and the zinc oxide crystal structure filler 4 is added at a rate of 10%, and the resin bond phase 2 is not mixed with a silane coupling agent and the zinc oxide crystal structure is The addition ratio of the filler 4 is set to 35% and the grinding wheel sheet for cutting does not contain the filler 5 in WC powder form, so there are ten kinds of grinding wheel sheets for cutting according to the present invention. The grinding wheel sheet for cutting has an outer diameter of 58 mm, an inner diameter of 40 mm, and a thickness of 0.3 mm. In addition, the resin bond phase 2 is a phenolic resin, and the abrasive 3 is a diamond abrasive with a particle size ...

no. 2 Embodiment

[0099] In this example, using the grinding wheel sheets for cutting in Examples 1 to 10 and Comparative Examples 1 and 2 described in Example 1, in which the compositions of the fillers are different, first, as Figure 4 As shown, the dicing of the QFN in which the Cu lead frame 12 is arranged at intervals in the molding resin 11 is performed. And, at the beginning of its cutting and when cutting 500m, measure the cutting resistance and the amount of wear of the thin blade abrasive layer when cutting 10m, and observe the cut surface to measure the size of the burrs extending from the Cu lead frame 12 (such as Figure 4 As shown, let the dimension of the burr extending laterally (feed direction) be X, and the dimension of the burr extending upward be Y). These results are shown in Table 7 at the initial stage of cutting, and in Table 8 at the time of 500-m cutting. In addition, cutting resistance was measured as the load current (A) of the motor which rotates the main shaft of...

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Abstract

This cutting blade is formed from at least one layer and has, as the filler disposed within a bond part (2) in a dispersed manner, a filler (4) containing a three-dimensional structure crystal (4a) in which needle-like parts extend in four directions from the center of a tetrahedron to each tip. The three-dimensional structure crystal (4a) is formed from zinc oxide and the length of needle-like parts (4aa) is within the range of 0.1 [mu]m to 100 [mu]m.

Description

technical field [0001] The present invention relates to a grinding wheel sheet for dicing used for dicing various electronic material components such as semiconductor devices. [0002] This application claims priority based on Japanese Patent Application No. 2011-041573 filed in Japan on February 28, 2011, and uses the content here. Background technique [0003] As electronic material components manufactured by dicing with a dicing grinding wheel, in addition to components such as semiconductor elements diced and divided from semiconductor wafers, mounted on lead frames and molded with resin, the following components are known, for example. [0004] (a) Like a part called QFN (quad flat non-leaded package), multiple components are mounted on a lead frame and molded together, and then cut into a single piece. Manufactured electronic material components. [0005] (b) Like the IrDA (Infrared Data Association, Infrared Data Association) standard optical transmission module (he...

Claims

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Application Information

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IPC IPC(8): B24D3/02B24D5/12
CPCB24D3/28B24D5/12
Inventor 中村正人
Owner TOKYO SEIMITSU
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