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Image pickup module

A shooting module, solid-state shooting technology, applied in instruments, televisions, applications, etc., can solve the problems of troublesome assembly, the reduction of the tube diameter of the endoscope of the shooting unit, which is not conducive to the narrowing of the shooting unit, etc. The effect of cost, efficient manufacturing

Inactive Publication Date: 2014-01-22
FUJIKURA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, since this configuration requires a block processed with high precision, and the FPC must be correctly fixed to the block, assembly is troublesome.
In addition, in the structure where the conductor of the cable is soldered to the parts arranged on both sides via the FPC block, the size including the soldered part and the conductor coating cannot be easily reduced, which is not conducive to the reduction of the diameter of the imaging unit (reduction Smaller diameter of the imaging unit) and downscaling of the tube of the endoscope (reducing the diameter of the endoscope)

Method used

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Examples

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Embodiment Construction

[0070] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0071] figure 1 The camera module 10 according to one embodiment of the present invention and the front end (tip end) structure of a lens-equipped camera module 11 assembled using the camera module 10 are shown.

[0072] Such as figure 1 , Figure 5B As shown, in the imaging module 10, the flexible wiring board 30 (flexible printed circuit board) on which the solid-state imaging element 22 (hereinafter, simply referred to as the imaging element) having the imaging unit 21 is mounted is electrically connected to the end of the cable 1. The tip of the conductor (the inner conductor 2 a and the outer conductor 2 b described later). For example, a CMOS (Complementary Metal Oxide Semiconductor) can be preferably used as the imaging element 22 .

[0073] This imaging module 10 has a front unit unit 110 in which an imaging element 22 is mounted on a flexible wiring board...

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Abstract

An image pickup module is provided with: an electric cable (1); a solid-state image pickup element (22) having an image pickup section (21) orthogonal to the axis line direction of the leading end of the electric cable (1); and a flexible wiring board (30, 30A), which has an element mounting section (32) having the solid-state image pickup element (22) mounted thereon, two extending sections (34e, 35e) that are bent on both the sides of the element mounting section (32) and extending from the element mounting section (32) such that the extending sections are closer to each other when further from the element mounting section (32), two connecting piece sections (34f, 35f) extending in the axis line direction of the leading end of the electric cable (1) from the two extending sections (34e, 35e), said two connecting piece sections being on the side opposite to the element mounting section (32), and terminal sections (34c, 34d, 35c, 35d) that are connected to the electric cable (1) by being provided on the two connecting piece sections (34f, 35f), said flexible wiring board electrically connecting between the solid-state image pickup element (22), and the electric cable (1).

Description

technical field [0001] The present invention relates to an imaging module having a structure in which a solid-state imaging element and a cable are electrically connected via a flexible wiring board, a camera module with a lens configured using the imaging module, an endoscope, a method for manufacturing the imaging module, and a flexible wiring board molding device. [0002] This application claims priority based on Japanese application No. 2012-082972 for which it applied on March 30, 2012, and uses the content here. Background technique [0003] Conventional electronic endoscopes often have a configuration in which an imaging module including an imaging unit having a solid-state imaging element (hereinafter, simply referred to as imaging element) is housed in an insertion portion of the electronic endoscope is assembled at the tip of a cable. [0004] The imaging unit as the imaging module widely adopts a configuration in which a flexible printed circuit board (hereinafte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225A61B1/04G02B23/24
CPCA61B1/04G02B23/2484H01L24/11H01L24/13H01L24/16H01L24/81H01L2224/1134H01L2224/1146H01L2224/13101H01L2224/16225A61B1/051Y10T29/49128Y10T29/532A61B1/0011H04N23/555H04N23/57H01L2924/014A61B1/005
Inventor 濑木武松田雄大山上胜哉中楯健一
Owner FUJIKURA LTD
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