Device for bonding semiconductor chips

Abstract

A device for bonding semiconductor chips is a packaging mechanism which is used for bonding and fixing the chips or used for stacking multiple chips. The device comprises a first feeding conveying mechanism, a second feeding conveying mechanism, a pre-pressing module and a main pressing fit module. A packaging carrier is conveyed to a position for performing pre-pressing fit of the pre-pressing module through the first feeding conveying mechanism and the second feeding conveying mechanism respectively, and the packaging carrier which has been processed in a pre-pressing fit is conveyed to or made to remain in the position for performing main pressing fit of the main pressing fit module respectively through the first feeding conveying mechanism and the second feeding conveying mechanism respectively. The pre-pressing module can apply pressure to enable at least one chip to be in pre-pressing fit with the packaging carrier or another chip on the packaging carrier. Then, the multiple chips which have been processed in a pre-pressing fit are stressed by multiple pressing-fit heads of the main pressing fit module at the same time, and thus the multiple chips are in main pressing fit with the packaging carrier or the chip on the packaging carrier.

Description

technical field [0001] The invention relates to a device for adhering semiconductor chips, in particular to a packaging device used in the die bonding process for making semiconductor electronic components. Background technique [0002] In the entire semiconductor packaging process, the process immediately after wafer dicing is the die bonding (or called die bonding, die attaching or die bonding) process, which is the process of cutting each independent chip on the wafer due to the dicing line. (or chip die) are sequentially picked and placed on the lead frame or the substrate, and the lead frame and the chip are firmly combined with each other by adhesive (eg: silver glue) or adhesive tape. [0003] figure 1 It is a schematic diagram of the main mechanism of an existing die bonding machine. The substrate 5 (substate) is loaded from the feed end on the left side of the conveyor rail 19 , and the substrates 5 loaded in sequence are transferred to the discharge end of the co...

AI Technical Summary

Problems solved by technology

The feeding jaws 17 are alternately transported to the discharge end in a relay manner, and the warping of the substrate 5 often causes the feeding jaws 17 to be incorrectly clamped and positioned when they are replaced, resulting in collisions between the substrate 5 and the conveying guide rail 19 However, the jammed material, or even the chip 10 on the substrate 5 needs to be scrapped due to scratches or crystal collapse.

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