Dual-edge eccentric copper-foil punching tool with improved structure

A hole cutter and double-edged technology, applied in drilling accessories, manufacturing tools, drilling/drilling equipment, etc., can solve problems such as unfavorable quality, hidden dangers, copper foil tearing, etc., and achieve convenient processing and no tearing Effect
CN103586508AInactive Publication Date: 2014-02-19DALIAN PACIFIC ELECTRONICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DALIAN PACIFIC ELECTRONICS
Publication Date
2014-02-19
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a dual-edge eccentric copper-foil punching tool with an improved structure. The dual-edge eccentric copper-foil punching tool comprises a tool handle and edges. The dual-edge eccentric copper-foil punching tool is characterized in that the edges are of a dual-edge structure comprising a main cutting edge and an auxiliary cutting edge; a chip discharge groove is formed between bodies of the main cutting edge and the auxiliary cutting edge; the top end of the main cutting edge is 0.5-2.0mm longer than that of the auxiliary cutting edge. When the punching tool is used for punching a pin hole of copper foil, the main cutting edge pre-cuts the copper coil, and then the auxiliary cutting edge cuts the copper foil finely, so that cutting force of the edges to the copper foil is divided into two stress processes, and adhesion caused by overlarge cutting force to the copper foil during punching is avoided. The dual-edge eccentric copper-foil punching tool has the advantages of simple structure, convenience in operation, high practicability and the like; the edge of the pin hole is smooth, burr-free and crack-free, and accordingly, great convenience is brought to follow-up processing.
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Description

technical field

[0001] The invention relates to a double-edged eccentric copper foil punching tool with an improved structure. Background technique

[0002] In the manufacturing process of multilayer printed circuit boards, there are two stacking methods commonly used in the lamination process: Mass stacking (that is, spot welding positioning) and PIN hole stacking (that is, pin positioning), among which PIN hole stacking is mainly It is aimed at thick boards and high-layer boards, in order to improve the deflection problem of sliding boards in the lamination process of such production boards, improve the alignment accuracy between layers and the product qualification rate. In the PIN hole stacking process, it is necessary to drill PIN holes for the core material, copper foil and prepreg of the printed circuit board in advance. , Among them, the core material PIN hole is processed by a special drilling machine for drilling positioning holes, and the copper foil and prepreg ...

Claims

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