LED packaging process

Abstract

The invention discloses an LED packaging process which comprises the following steps: a die bonding step in which a die bonding machine dispenses UV photo-curing LED die bonding glue in die bonding areas of a plurality of brackets on a bracket assembly and places a crystalline grain in the die bonding area of each bracket; a UV photo-curing step in which a UV photo-curing machine cures the UV photo-curing LED die bonding glue; a wire welding step in which a wire welding machine respectively welds the two ends of a metal wire to an electrode of each crystalline grain and an electrode of the corresponding bracket to enable a plurality of semi-finished LED products to be formed on the bracket assembly; a glue dispensing step in which a glue dispensing machine pours UV photo-curing LED encapsulation glue on a crystalline grain in each LED semi-finished product; a UV photo-curing step in which the UV photo-curing machine cures the UV photo-curing LED encapsulation glue to enable a plurality of finished LED products to be formed on the bracket assembly; a material cutting step in which a material cutting machine separates the finished LED products from the bracket assembly so as to form a plurality of independent LED products; and a sorting step in which quality inspection and screening are carried out on the finished LED products by a sorting machine, wherein the material cutting step and the sorting step can be selectively added. The LED packaging process has the advantages of short time, low energy consumption, high production efficiency and easy realization of full automation.

Description

Technical field: [0001] The invention relates to the technical field of LED encapsulation technology, in particular to an LED encapsulation process with short time consumption, low energy consumption, high production efficiency and full automation. Background technique: [0002] With the increasing emergence of energy and environmental issues, more and more attention has been paid to the energy-saving industry and its products, and the energy-saving effect of semiconductor diode (LED) lighting has been recognized. [0003] LED (Light Emitting Diode, light-emitting diode) is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electrical energy into light energy. LED is widely used as a new lighting source material. The LED packaging technology plays a key role in the light-emitting efficiency of light-emitting diodes. [0004] The traditional LED packaging process generally includes the following steps: solid...

AI Technical Summary

Problems solved by technology

[0005] The above-mentioned traditional LED encapsulation process has the following disadvantages: the thermosetting resin used in the die-bonding step must be baked in a hot oven (at a temperature of 150° C.) for at least 60 minutes to cure the thermosetting resin; The silica gel used in the glue step needs to be baked in a hot oven (at 150°C) for 120-300 minutes to cure the silica gel. Therefore, the entire LED packaging process takes a long time, which is not conducive to the realization of fully automatic production of the entire process. , leading to low production efficiency

In addition, due to the longer baking time, higher electrical energy is required, that is, higher production costs are required, so that it cannot meet the needs of modern development and improve market competitiveness.

Images