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Multilayer ceramic substrate and manufacturing method thereof

一种多层陶瓷、基板的技术，应用在多层电路制造、制造测量仪器、印刷电路制造等方向，能够解决连接部面积变小、电阻膜与过孔导体连接可靠性下降等问题，达到优异电阻特性、牢固连接强度、小连接面积的效果

Active Publication Date: 2017-06-09
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, as mentioned above, if a structure in which the resistance film is drawn out using a via conductor is adopted with emphasis on achieving excellent TCR characteristics, the area of ​​the connection portion will become smaller, so that the connection between the resistance film and the via conductor will be reliable later. The problem of sexual decline

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  • Multilayer ceramic substrate and manufacturing method thereof
  • Multilayer ceramic substrate and manufacturing method thereof
  • Multilayer ceramic substrate and manufacturing method thereof

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Embodiment Construction

[0049] refer to figure 1 , the multilayer ceramic substrate 1 according to Embodiment 1 of the present invention will be described.

[0050] The multilayer ceramic substrate 1 includes ceramic domains 3 composed of a plurality of laminated ceramic layers 2 . A resistor 4 is arranged inside the ceramic element 3 .

[0051] The resistor body 4 includes a plurality of layers formed between a plurality of ceramic layers 2, for example, two layers of resistance films 5 and 6; and a plurality of, for example, two via conductors for parallel connection arranged at different positions. 7 and 8, the parallel connection via conductors 7 and 8 are used to connect these resistance films 5 and 6 in parallel, and are formed so as to penetrate the ceramic layer 2 in the thickness direction. Via conductors 7 and 8 for parallel connection are preferably made of the same material as resistive films 5 and 6 . Accordingly, it is possible to make it difficult for each component to diffuse betwe...

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Abstract

The present invention provides a multilayer ceramic substrate capable of achieving ultra-low resistance below 100mΩ with excellent TCR characteristics, and even if a structure in which a resistive film is drawn out by a via-hole conductor is adopted, the resistance film and the via-hole conductor can be connected between the resistive film and the via-hole conductor. Get excellent connection reliability. A multilayer ceramic substrate (1) has a ceramic domain (3) composed of a plurality of laminated ceramic layers (2), and a resistor ( 4), and lead-out via conductors (9, 10) formed to penetrate the ceramic layer (2) in the thickness direction and to connect the first end portion (11) to the resistance film (5). Both the resistive film and the lead-out via-hole conductor contain Ni and Cu, which constitute the alloy resistance material, and the concentration of the Ni component in the lead-out via-hole conductor has a higher concentration than that in the first end (11) connected to the resistive film (5). An inclined structure that is higher and gradually becomes lower from the first end portion (11) to the opposite second end portion (12) side.

Description

technical field [0001] The invention relates to a multilayer ceramic substrate and a manufacturing method thereof, in particular to a multilayer ceramic substrate with a built-in resistance film and a manufacturing method thereof. Background technique [0002] For example, in the measurement of the remaining battery level in the remaining battery level detection circuit, an ultra-low resistance of 100mΩ or less is required for current detection resistors. In addition, the resistor for current detection is required to have a TCR (temperature coefficient of resistance) of, for example, less than 100 ppm / °C. [0003] For example, Japanese Patent Application Laid-Open No. 2004-356306 (Patent Document 1) discloses a ceramic substrate with resistance formed by firing a resistor body paste simultaneously with a ceramic substrate. In Patent Document 1, for example, a paste mainly composed of ruthenium oxide is used as a resistor paste. However, in the case of a ruthenium oxide-bas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/16
CPCH05K1/167H05K3/429H05K3/4629H05K2201/0269G01R1/203G01R3/00H05K1/0306H05K1/115H05K3/4614
Inventor 番场真一郎福田宽
Owner MURATA MFG CO LTD
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