Communication module of CMP integrated control system

Abstract

The invention provides a communication module of CMP integrated control system. The CMP integrated control system comprises a primary industrial personal computer, a lower computer set and a secondary industrial personal computer. The communication module is used for achieving communication between the primary industrial personal computer and the lower computer set and between the primary industrial personal computer and the secondary industrial personal computer. The communication module comprises an OPC access submodule and a TCP / IP access submodule, and the two submodules run concurrently; the primary industrial personal computer is used for obtaining the status information and procedure parameters of a plurality of technology units from the lower computer set through the OPC access submodule, sending control instructions for controlling the technology units to run, technological formula and technological parameters to the lower computer set, sending control instructions to the secondary industrial personal computer through the TCP / IP access submodule so as to lead the secondary industrial personal computer to control integrated units to execute corresponding actions, and receiving feedback of the secondary industrial personal computer. The communication module has the advantages of being safe, stable and reliable, and is convenient to maintain and good in expandability.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to a communication module of a CMP integrated control system. Background technique [0002] In the manufacturing process of integrated circuits, the traditional planarization technology is limited to local planarization, which cannot meet the requirements of global planarization in VLSI manufacturing process. As the most widely used global planarization technology at present, Chemical Mechanical Planarization (CMP) can meet the requirements of wafer surface roughness and surface flatness, and obtain a damage-free wafer surface. [0003] At present, CMP technology has developed into a chemical mechanical planarization technology with a chemical mechanical polishing machine as the main body, integrating measurement and cleaning technologies, which can better improve productivity, reduce manufacturing costs, and achieve global substrate planarization. CMP equipme...

AI Technical Summary

Problems solved by technology

However, for the unit to be integrated, because the unit is directly controlled by the secondary industrial computer, OPC communication mode is not applicable, so the main industrial computer cannot access the integrated unit through the original communication module, and the original OPC communication module limits the expansion of the CMP system

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