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Chip to package interface

A chip and encapsulant technology, applied in the direction of electrical components, fixed transformers or mutual inductance, transformer/inductance parts, etc.

Active Publication Date: 2014-03-26
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The first coil is placed in the semiconductor chip
A dielectric layer is placed over the encapsulant and semiconductor die
The second coil is placed over the dielectric layer

Method used

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  • Chip to package interface
  • Chip to package interface
  • Chip to package interface

Examples

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Embodiment Construction

[0026] The implementation and use of the various embodiments are discussed in detail below. However, it should be understood that the present invention provides many applicable creative concepts that can be embodied in many specific environments. The specific embodiments discussed are merely illustrative of specific ways for implementing and using the present invention, rather than limiting the scope of the present invention.

[0027] Many applications based on wireless transmission at millimeter wave frequencies may require a package structure that protects components in the package against mechanical and environmental stress without significantly increasing the package cost. In addition, the signal loss introduced by the transition from the printed circuit board to the chip receiver / transmitter interface of the semiconductor package may limit the performance of the millimeter wave semiconductor chip. Because of the loss caused by the signal return path, this problem is exacerb...

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Abstract

The invention relates to a chip to a package interface. In accordance with an embodiment of the present invention, a semiconductor package includes a semiconductor chip disposed within an encapsulant, and a first coil disposed in the semiconductor chip. A dielectric layer is disposed above the encapsulant and the semiconductor chip. A second coil is disposed above the dielectric layer. The first coil is magnetically coupled to the second coil.

Description

Technical field [0001] The present invention relates generally to a semiconductor package, and more specifically to a chip-to-package interface. Background technique [0002] Recently, interest in the millimeter wave spectrum at 30 GHz to 300 GHz has sharply increased. The advent of low-cost, high-performance Si-based technology has opened new perspectives for system designers and service providers, as it enables the development of millimeter-wave radios with the same cost structure of radios operating in the gigahertz range or lower. In combination with the available ultra-wide bandwidth, this makes millimeter waves for new types of systems and applications that support all kinds of ultra-high-speed data transmission, video distribution, portable radar, sensing, detection and imaging, The spectrum is more attractive than ever. [0003] However, utilizing the millimeter-wave radio spectrum requires the ability to design and manufacture low-cost, high-performance RF front ends for...

Claims

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Application Information

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IPC IPC(8): H01L23/66
CPCH01L23/31H01L2224/04105H01L2924/10253H01L24/19H01L23/3121H01L21/568H01L2924/13091H01L23/66H01L21/561H01L2224/12105H01L23/5389H01F19/04H01F27/2804H01L23/49816H01L23/5227H01L23/645H01L24/96H01L24/97H01L2223/6677H01L2224/0401H01L2924/01322H01L2924/181H01L2924/00H01L23/48H01L21/56H01L24/03H01L2224/0231
Inventor G.萨波内
Owner INFINEON TECH AG