A graphene-based flexible optoelectronic device packaging method
A technology for optoelectronic devices and packaging methods, applied in the direction of electrical solid devices, electrical components, semiconductor devices, etc., can solve the problems of immature technology, damage to devices, and high equipment investment, and achieve practicality and mass production. Good mechanical flexibility The effect of sex, high application value
Active Publication Date: 2016-05-04
FUZHOU UNIV
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Problems solved by technology
The traditional optoelectronic device packaging process uses adhesives to bond the substrate and the package cover to form an airtight space to protect the optoelectronic device. This process is mature, simple and strong, but for the packaging of large-sized devices, the cover is easily damaged. The deformation caused by external force factors such as gravity will cause the cover plate to contact the device and damage the device; at the same time, for flexible devices, when using flexible polymer film as the cover plate for packaging, it is easy to cause the packaging film to break when the device is bent or folded. Damage to the device due to contact with the light-emitting area of the device
In response to the defects of cover plate packaging, people began to turn their attention to thin-film packaging. Thin-film packaging is to deposit multi-layer films on the cathode surface of optoelectronic devices. Among them, VitexSystem’s Barix packaging technology is a representative, which is a compound-based way to seal optoelectronics. The device method is to prepare organic and inorganic alternate multi-layer films on the surface of the device cathode, but the thin film packaging still has pinholes, high equipment investment, low production efficiency, and the current process is not mature
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[0040] Such as figure 1 As shown, the present invention provides a kind of graphene-based flexible optoelectronic device packaging method, comprising the following steps:
[0041] S1: providing a substrate;
[0042] S2: preparing an optoelectronic device on the substrate; such as figure 2 As shown, a photoelectric device 20 is prepared above the substrate 10, and the photoelectric device includes a bottom electrode 201, an organic functional layer 202 and a top electrode 203;
[0043] S3: preparing an electrical isolation layer on the upper part of the optoelectronic device; as image 3 As shown, an electrical isolation layer 30 is prepared above (the top electrode 203 of) the optoelectronic device 20;
[0044] S4: preparing a composite film (as an encapsulation layer);
[0045] S5: Cover the composite film prepared in the step S4 on the upper part of the electrical isolation layer prepared in the step S3 (the graphene faces the electrical isolation layer to complete the ...
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Abstract
The invention relates to a graphene-based flexible optoelectronic device packaging method, which is characterized in that it comprises the following steps: S1: providing a substrate; S2: preparing an optoelectronic device on the substrate; S3: preparing the optoelectronic device on the substrate Prepare an electrical isolation layer on the upper part; S4: prepare a composite film; S5: cover the composite film prepared in the step S4 on the upper part of the electrical isolation layer prepared in the step S3. The graphene layer / polymer laminated composite film provided by the invention has a good water and oxygen barrier function, good mechanical flexibility, and has high application value in the packaging of optoelectronic devices.
Description
technical field [0001] The invention relates to the field of photoelectric device packaging, in particular to a graphene-based flexible photoelectric device packaging method. Background technique [0002] Flexible optoelectronic devices are devices with optoelectronic properties made of flexible substrate materials (such as transparent plastic films or metal sheets instead of ordinary glass substrates), such as light-emitting devices, photovoltaic devices, etc. The traditional optoelectronic device packaging process uses adhesives to bond the substrate and the package cover to form an airtight space to protect the optoelectronic device. This process is mature, simple and strong, but for the packaging of large-sized devices, the cover is easily damaged. The deformation caused by external force factors such as gravity will cause the cover plate to contact the device and damage the device; at the same time, for flexible devices, when using flexible polymer film as the cover pla...
Claims
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IPC IPC(8): H01L33/52
CPCH10K71/00
Inventor 李福山郭太良吴晓晓吴薇吴朝兴陈伟杨开宇曾群英
Owner FUZHOU UNIV