Boss-type metal-based sandwich rigid-flex plate and production method thereof

Abstract

The invention discloses a boss-type metal-based sandwich rigid-flex plate and a production method thereof. The rigid-flex plate comprises rigid sub plates, flex sub plates, medium layers and a metal core layer. At least one metal boss and at least one cooling area are arranged on each of the front side and the reverse side of the metal core layer. The medium layers and the rigid/flex sub plates are stacked sequentially on the front side and the reverse side of the metal core layer respectively. First opening areas matched with the metal bosses and second opening areas corresponding to the cooling areas are arranged on each of the rigid sub plate, the flex sub plate and the medium layer. The boss-type metal-based sandwich rigid-flex plate produced by the production method is cooled by the metal core layer (provided with the metal bosses on the front and the reverse sides); through the cooling mode good in reliability, cooling requirements of both partially-heating electronic components (through the metal bosses) and high-density circuits during working (through the metal core layer and the cooling areas) can be met.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a boss-type metal-based sandwich rigid-flex board and a preparation method thereof. Background technique [0002] With the high-speed transmission of electronic products and the development of precise and small designs, the heat generation density of electronic products continues to increase, and the heat dissipation performance of products has become a performance index that people pay more and more attention to. As an important component of electronic products, the poor heat dissipation of rigid-flex products will cause the electrical performance of components to decline or even be damaged. Therefore, rigid-flex products with good heat dissipation performance determine their importance in applications. [0003] In order to solve the heat dissipation problem, the following methods are currently applied to PCB products. These methods have their disadvantages, and i...

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Problems solved by technology

[0006] (3) Conductive and heat-dissipating silver paste and copper paste board: Use copper paste and silver paste with certain thermal conductivity through plug holes to quickly transfer the heat of surface electronic components to the corresponding grounded large copper surface for heat dissipation, especially It is a large copper surface on the surface, and the cost is high;

[0007] (4) Embedded copper block PCB: embedded copper block inside the multilayer PCB, local heat dissipation, copper block does not match the CTE of the PCB dielectric layer, and the reliability is limited;

[0008] (5) Metal-based sandwich PCB: the development version of buried copper block PCB, which is pressed together with the PCB circuit layer as a separate non-circuit layer, and the heat is dissipated from the surroundings of the board. The metal core is difficult to process as a single layer, and the reliability is difficult to guarantee

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