Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Broadband electromagnetic band gap structure

A technology of electromagnetic bandgap structure and electromagnetic bandgap unit, which is applied in the direction of printed circuit components, etc., can solve problems such as high-frequency synchronous switching noise, and achieve the effect of easy implementation and high efficiency

Inactive Publication Date: 2014-03-26
XIDIAN UNIV
View PDF3 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, adding a decoupling capacitor between the power supply and the ground plane is the most commonly used method, but when the frequency is higher than 600MHz, there is a parasitic inductance in the decoupling capacitor, and the parasitic inductance will self-resonate with the capacitor, which limits the frequency bandwidth. Decoupling capacitors are ineffective for frequency applications above 600MHz and typical synchronous switching noise has a low-pass spectrum below 6GHz, so bypassing techniques using decoupling capacitors cannot solve the problem of high frequency synchronous switching noise

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Broadband electromagnetic band gap structure
  • Broadband electromagnetic band gap structure
  • Broadband electromagnetic band gap structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Such as figure 1 As shown, a broadband electromagnetic bandgap structure at least includes a non-conductive substrate 1, the non-conductive substrate 1 is covered with a metal plate 2, the metal plate 2 is corroded into electromagnetic bandgap units 3 distributed at intervals, and the electromagnetic bandgap units 3 distributed at intervals There are two gap units 3, which are arranged side by side.

Embodiment 2

[0025] Such as figure 2 As shown, a broadband electromagnetic bandgap structure at least includes a non-conductive substrate 1, the non-conductive substrate 1 is covered with a metal plate 2, the metal plate 2 is corroded into electromagnetic bandgap units 3 distributed at intervals, and the electromagnetic bandgap units 3 distributed at intervals There are nine gap units 3, and the nine are distributed into 3*3 squares.

[0026] Such as image 3 As shown, the electromagnetic bandgap unit 3 is composed of a square body 4 on one side of the non-conductive substrate 1, conductor lines 5 extending outward on the four sides of the square body, and an L-bridged EBG structural unit 6 on the other side, and the four sides are outwardly The extended conductor line 5 is perpendicular to the four sides of the square body 4, and the four sides extend outward. The conductor line 5 extends outward from the 1 / 3-1 / 4 position of the connecting side, and the starting point 7 is close to the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Side lengthaaaaaaaaaa
Login to View More

Abstract

The invention is applied to the field of printed circuit boards, and particularly relates to a broadband electromagnetic band gap structure applied to a power plane of a printed circuit board. The broadband electromagnetic band gap structure at least comprises a nonconductive substrate, metal boards are covered on and under the nonconductive substrate and corroded to be electromagnetic band gap units distributed at intervals, a gap is etched on a metal paster in a unit cell of the electromagnetic band gap structure, and a groove is formed around the metal paster in the unit cell of the electromagnetic band gap structure. The broadband electromagnetic band gap structure has wider relative bandwidth and lower cutoff frequency, basically covers noise frequency band of simultaneous switch noise and can omnidirectionally eliminate simultaneous switch noise positioned between the power plane and a ground plane. Due to adoption of an existing conventional printed circuit board manufacturing process, the broadband electromagnetic band gap structure is easy to realize and high in benefit.

Description

technical field [0001] The invention is applied to the field of printed circuit boards, and in particular relates to a broadband electromagnetic bandgap structure applied to the power supply plane of the printed circuit board. Background technique [0002] With the development of modern high-speed digital circuits, the problem of synchronous switching noise between the power plane and the ground plane has become more and more prominent due to reasons such as fast edge rise rate, high clock rate and low voltage level. Synchronous switching noise is caused by multiple resonance modes between the power plane and the ground plane when the currents of multiple active devices on the printed circuit board are switched simultaneously, and synchronous switching noise will cause problems such as signal integrity and electromagnetic compatibility. The printed circuit board is a very important part of the electromagnetic compatibility in the system, so how to eliminate the synchronou...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/02
Inventor 路宏敏王向荣梁博
Owner XIDIAN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products